Latest improvements in microbolometer thin film packaging: paving the way for low-cost consumer applications

Yon, Jean-Jacques; Dumont, G.; Goudon, V.; Becker, S.; Arnaud, A.; Cortial, S.; Tisse, Christel-Loïc

doi:10.1117/12.2050378

Cited by 5 publications

(3 citation statements)

References 8 publications

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“…Although the wafer level packaging technology provides a significant cost reduction, it still takes a considerable proportion in the total cost of the uncooled IRFPA, especially for the low-end market. A pixel level packaging (PLP) technology has been developed to address this issue [ 104 , 105 , 106 ]. The PLP process consists in the manufacturing of IR transparent microcaps that cover each pixel in the direct consequent step of the wafer level bolometer fabrication, i.e., no extra bonding process is needed.…”

Section: Vacuum Packaging Technologymentioning

confidence: 99%

Low-Cost Microbolometer Type Infrared Detectors

Guo

Zhu

et al. 2020

Micromachines

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The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging.

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Section: Vacuum Packaging Technologymentioning

confidence: 99%

Low-Cost Microbolometer Type Infrared Detectors

Guo

Zhu

et al. 2020

Micromachines

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“…The most popular vacuum packaging technology for uncooled IRFPAs is one‐by‐one pumping through a fine‐bore tube, and this packaging process has been a bottleneck in lowering the cost of uncooled IRFPAs. Efforts have been made to improve the productivity and reduce cost in the vacuum packaging process, and various vacuum packaging technologies have been reported up to now, including wafer‐level packaging , collective packaging , chip‐scale packaging , batch packaging , and pixel‐level packaging technologies.…”

Section: Development Trendsmentioning

confidence: 99%

Uncooled infrared focal plane arrays

Kimata

2017

IEEJ Transactions Elec Engng

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After a long incubation period, commercialization of uncooled infrared focal plane arrays (IRFPAs) is progressing rapidly. In the high-end field, pixel pitch reduction is approaching the diffraction limit of optics, and full high-definition IRFPAs have been reported. On the other hand, low-cost infrared array sensors (IRASs), which are small-format IRFPAs for non-imaging applications, are finding new applications in areas such as home appliances. This paper reviews the basics of and advances in uncooled IRFPAs, including IRASs. Some emerging trends in business and applications are also discussed.

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“…There are several vacuum packaging methods reported including die level packaging [13][14][15][16] and wafer level packaging [17][18][19][20][21][22]. There are also efforts to make pixel level vacuum packaging where the packaging process is the part of detector fabrication process [23][24][25][26][27][28][29][30][31][32]. By this method, the need for expensive packaging equipment like a wafer bonder can be eliminated.…”

Section: Introductionmentioning

confidence: 99%

Pixel level vacuum packaging for single layer microbolometer detectors with on pixel lens

Tanrikulu

2022

Journal of Electrical Engineering

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This paper presents a new approach for fabrication of single layer microbolometer detectors featuring pixel level vacuum packaging together with a lens on the pixel. The proposed lens structure can be used to increase the fill factor of the detector so that the pixel size can be decreased without decreasing the minimum feature size in the detector which is a problem in single layer microbolometers. The designs of the lens and the fabrication process of pixel level vacuum packaged microbolometer detector together with this lens are given in the framework of this study. The optical and mechanical simulations of the structure are performed. The radius of curvature of the lens is optimized to be 25 μm and it is shown that the condensing efficiency is 100% for 3 μm lens-detector distance. The deflection in the lens structure is found approximately as 0.8 nm in 1 atm environment pressure, showing that the proposed structure is durable. The proposed structure increases the fill factor to twice of the original value without decreasing the minimum feature size in the fabrication processes, resulting in the same amount of improvement in the performance of the detector. This approach can also be used to increase the yield and decrease the fabrication cost of single layer and also standard microbolometers with small pixel sizes, as it integrates the vacuum packaging in the fabrication steps.

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Latest improvements in microbolometer thin film packaging: paving the way for low-cost consumer applications

Cited by 5 publications

References 8 publications

Low-Cost Microbolometer Type Infrared Detectors

Low-Cost Microbolometer Type Infrared Detectors

Uncooled infrared focal plane arrays

Pixel level vacuum packaging for single layer microbolometer detectors with on pixel lens

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