Lattice Boltzmann method study of bga bump arrangements on void formation

Abas, Aizat; Ishak, M. H. H.; Abdullah, M. Z.; Ani, F. Che; Khor, Soon Fuat

doi:10.1016/j.microrel.2015.10.014

Cited by 31 publications

(22 citation statements)

References 19 publications

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“…The trajectory of the nanoparticles typically at the higher pressure region have the lower possibility of the micro-voids formation. This was proven in a research by A. Abas et al [13] and M. H.H Ishak et. As the size of the particles in the nano-scale, the nanoparticles are exerted velocity same as the al [14] which found that the possibility of void formation is lower at higher pressure distribution.…”

Section: Numerical Simulation Setupmentioning

confidence: 65%

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

Mukhtar¹,

Abas

Haslinda

et al. 2018

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. This paper presents a preliminary study of the interaction between two models of numerical simulation namely volume of fluid (VOF) and discrete phase model (DPM). The multiphase-DPM model is capable of tracking the trajectory of the TiO2 nanoparticles that has been doped in the lead free solder Sn-3.0Ag-0.5Cu (SAC305). The current model was developed based on passive surface mount component 01005 capacitor that undergoes conventional reflow process. The trajectory of the nanoparticles at 0.01, 0.05 and 0.15wt% in the molten solder is shown in the flow front of the wetted molten solder. At 0.05wt% of nanoparticles, good dispersion of nanoparticles, pressure distribution and wetting time was found. The difference in wetting time are about 3.76% and 0.46% for 0.05wt% and 0.15wt% compared to 0.01wt% nanoparticle. The trajectory of the nanoparticles are shown to move along with the wetting formation of the molten solder. The pressure distribution and velocity vector of the different weight percentage of nanoparticles are also be studied. Higher pressure distribution is found at the capacitor area and intermetallic compound (IMC) region. The higher pressure distribution projected to reduce the micro void formation and optimize the reliability of the solder joint.

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Section: Numerical Simulation Setupmentioning

confidence: 65%

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

Mukhtar¹,

Abas

Haslinda

et al. 2018

IOP Conf. Ser.: Mater. Sci. Eng.

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“…The addition of nanoparticles in the molten solder has been found to improve the voiding properties in the solder. Based on the computed trajectory of the nanoparticles, it was found that the presence of higher concentration of nanoparticles will increase the domain of higher pressure region henceforth reducing the possibility of micro-void formation as supported by researches done Abas et al (2015) and Ishak et al (2016). From the previous study, it was also found that higher pressure region enables flow front to combine thus further inhibits void formation in solder joint .…”

Section: Pressure Distributionmentioning

confidence: 73%

“…Benabou et al (2016) study on the use of Finite Element Analysis for fatigue lifetime of a lead-free solder joint under thermal cycling found that the reliability of the solder joint depends heavily on void configuration. In a study by Abas et al (2015) using Finite Volume Method, the group concerted their effort to study the effect of dispensing types for encapsulation process of electronic packaging applied on different solder bump arrangements. By utilizing a different numerical scheme, applied Lattice Boltzmann Method to observe flow model in a 3D model of BGA for different bump arrangements .…”

Section: Nomenclaturementioning

confidence: 99%

Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

Mukhtar¹,

Abas²,

Haslinda³

et al. 2019

JAFM

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The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free solder Sn-3.0Ag-0.5Cu (SAC305) is methodically investigated using Discrete Phase Model (DPM) simulation and applied on a 01005 capacitor component. Different types of nanoparticles, namely titanium dioxide (TiO2), nickle oxide (NiO) and Iron (III) oxide (Fe2O3) with varying weight percentages, 0.01wt%, 0.05wt% and 0.15wt% that is doped in SAC305 are used. The study of two-way interactions between multiphase volume of fluid (VOF) and discrete phase model (DPM) shows excellent capability in tracking the dispersed nanoparticles immersed in the wetted molten solder. In this study, real reflow profile temperature setup will be used to mimic the conventional reflow process. Based on the findings, the fillet height managed to achieve the minimum required height set by IPC standards. As the concentration of the nanoparticles doped in the molten solder increases, higher time is required for the wetting process. In general, the doped NiO nanoparticles at 0.05wt% has the lowest wetting time compared to other cases. The study of the instantaneous nanoparticles trajectory tracking was also conducted on a 3D model and 2D cross sectional view to identify the exact movement of the particles. Additionally, it was also observed that the velocity and pressure distribution increases as the weight percentage of the nanoparticles increases.

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“…The wettability of the flow front can be describe according to the surface tension value. Higher surface tension corresponds to higher value of Bond number leading to an increase in the voids formation [ 35 ]. Table 4 consists of the times for specific filling percentage for all orientations.…”

Section: Resultsmentioning

confidence: 99%

“…As depicted in Fig 27 , LBM formulation managed to capture the formation of void during the encapsulation process. At 40% and 60% filling percentage, the formation of voids are mostly located at the vicinity of the solder ball due to reverse flow phenomena [ 35 , 37 ]. At 80% filling percentage, the problem of voids formation is more severe and is concentrated at final two rows of the solder balls.…”

Section: Resultsmentioning

confidence: 99%

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

et al. 2016

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This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow front, pressure and velocity for different time intervals are determined and analyzed for potential problems relating to solder bump damage. The simulation results from Lattice Boltzmann Method (LBM) code will be validated with experimental findings as well as the conventional Finite Volume Method (FVM) code to ensure highly accurate simulation setup. Based on the findings, good agreement can be seen between LBM and FVM simulations as well as the experimental observations. It was shown that only LBM is capable of capturing the micro-voids formation. This study also shows an increasing trend in fluid filling time for BGA with perimeter, middle empty and full orientations. The perimeter orientation has a higher pressure fluid at the middle region of BGA surface compared to middle empty and full orientation. This research would shed new light for a highly accurate simulation of encapsulation process using LBM and help to further increase the reliability of the package produced.

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Lattice Boltzmann method study of bga bump arrangements on void formation

Cited by 31 publications

References 19 publications

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

Lattice Boltzmann Method of Different BGA Orientations on I-Type Dispensing Method

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