In
developing low-temperature cofired ceramic (LTCC) technology
for high-density packaging or advanced packaged electronics, matching
the coefficient of thermal expansion (CTE) among the packaged components
is a critical challenge to improve reliability. The CTEs of solders
and organic laminates are usually larger than 16.0 ppm of °C1–, while most low-permittivity (εr) dielectric ceramics have CTEs of less than 10.0 ppm °C1–. Therefore, a good CTE match between organic laminates
and dielectric ceramics is required for further LTCC applications.
In this paper, we propose a high-CTE BaSO4–BaF2 LTCC as a potential solution for high-reliability packaged
electronics. The BaSO4–BaF2 ceramics
have the advantages of a wide low-temperature sintering range (650–850
°C), low loss, temperature stability, and Ag compatibility, ensuring
excellent performance in LTCC technology. The 95 wt %BaSO4–5 wt %BaF2 ceramic has a εr of
9.1, a Q × f of 40,100 GHz
@11.03 GHz (Q = 1/tan δ), a temperature coefficient
of the resonant frequency of −11.2 ppm °C1–, a CTE of +21.8 ppm °C1–, and a thermal conductivity
of 1.3 W mK–1 when sintered at 750 °C. Furthermore,
a dielectric resonant antenna using BaSO4–BaF2 ceramics, a typically packaged component of LTCC and laminate,
was designed and used to verify the excellent performance by a gain
of 6.0 dBi at a central frequency of 8.97 GHz and a high radiation
efficiency of 90% over a bandwidth of 760 MHz. Good match and low
thermal stress were found in the packaged components of BaSO4–BaF2 ceramics, organic laminates, and Sn-based
solders by finite element analysis, proving the potential of this
LTCC for high-reliability packaged electronics.