Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions

Watanabe, Atom O.; Lin, Tong‐Hong; Raj, P. Markondeya; Tentzeris, Manos M.; Tummala, Rao; Ogawa, Teppei

doi:10.1109/ectc.2018.00304

Cited by 24 publications

(10 citation statements)

References 19 publications

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“…Integration of multiple components into a package require more complicated signal routing and power delivery network in a limited space, to attain the required signal and power integrity and the control of electromagnetic-interference (EMI). The dielectric thickness for signal routing and power distribution can be 15 µm and lower [28].…”

Section: B Novel Circuit Design Techniquesmentioning

confidence: 99%

“…From the industry standpoint, Infineon, TSMC, ASE, Amkor, Deca Technologies, JCET, and several more companies have been leading the wafer-level fan-out technology for RF/mm-wave applications. In conjunction with the molding-compound-based waver-level IC-embedding technology, laminate-based and glass-based panel-level embedding technology is also emerging as an alternative candidate, mainly led by Samsung, Unimicron, ASE, and Deca Technologies from the industry, and Institute of Microelectronics (IME) [44] and Georgia Tech Packaging Research Center (GT-PRC) from the research standpoint [28], [45].…”

Section: A Packaging Trends For 5g Systemsmentioning

confidence: 99%

“…The mechanical and process limitations of organic laminates from their low modulus and high CTE are addressed with emerging inorganic substrates, as listed in Table III. Glass substrates offer a wide range of Dk (3.7 -8) and Df (0.0003 for fused silica to 0.006 for alkaline-free borosilicate), smooth surface, good dimensional stability (< 2µm for 20mm substrates), large-panel scalability, ability to form finepitch through vias, stability to temperature and humidity, and tailorable CTE depending on the packaged components [28], [46][47][48][49]. Companies such as Samtec and Unimicron manufacture glass-based packages.…”

Section: B Materials For Core Prepreg and Buildupmentioning

confidence: 99%

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A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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157

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Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have emerged as a follow-on to 4G, and projected to have 100X higher wireless date rates and 100X lower latency than those with current 4G networks. Major challenges arise in the packaging of radio-frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3D ultra-thin packages with higher component densities and performance than with the existing 2D packages is needed to realize such 5G systems. This paper reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.

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Section: B Novel Circuit Design Techniquesmentioning

confidence: 99%

Section: A Packaging Trends For 5g Systemsmentioning

confidence: 99%

Section: B Materials For Core Prepreg and Buildupmentioning

confidence: 99%

See 1 more Smart Citation

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

Self Cite

157

View full text Add to dashboard Cite

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“…Up to now, however, only a few end-fire antennas have been realized by using the glass substrate [14]- [16]. In [10], a 28 GHz Yagi-Uda antenna is designed, and it achieves a simulated gain of higher than 4 dBi with more than 20% relative bandwidth. In [11], a wideband 28 GHz on-glass end-fire array for 5G handsets is proposed, and its simulated relative bandwidth is 11.3% with a gain of 7.08 to 8.36 dBi over the operating band.…”

Section: Introductionmentioning

confidence: 99%

A 1 × 2 Taper Slot Antenna Array With Flip-Chip Interconnect via Glass-IPD Technology for 60 GHz Radar Sensors

Xia

Zhang

et al. 2020

IEEE Access

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A low cost, broadband and compact antenna in package solution (AiP) is proposed for 60 GHz low-power radar sensor applications. Following a glass integrated passive device (Glass-IPD) manufacturing process, a compact low cost taper slot antenna (TSA) is designed on a substrate with a thickness beyond Yngvesson's range. To realize high gain and front-to-back ratio, the antenna is optimized by introducing a truncated ground. A 1 × 2 antenna array prototype is realized with a dummy transmission line chip in the dimension of 5 × 7.4 mm 2. Including the flip chip interconnect, the measured results demonstrate a 10 dB impedance bandwidth of 47.2 ∼ 67 GHz. The calculated gain is higher than 6.5 dBi in the end-fire direction over the entire 60 GHz band. Based on a physical RLC equivalent circuit, by co-design of the antenna with solder balls, the flip chip interconnect is compensated with a passive network. For the compensation network, its working bandwidth is from 0.1 to 67 GHz, while its insertion loss at 60 GHz is less than 0.2 dB. INDEX TERMS 60 GHz, antenna in package (AiP), CPW-slotline transition, flip-chip, glass integrated passive device (Glass-IPD), radar sensors, taper slot antenna (TSA).

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“…Besides above materials, silicon based interposer provides high I/O interconnections and integration capability, but its cost and loss is relatively high [17]. To address the above challenges, glass substrate has attracted considerable attention due to its low dielectric loss, high I/O density, large-area low-cost panel-scale process capability, and matched CTE with silicon devices and high reliability [18]- [20]. In addition, due to its high optical transparency, the glass substrate is a good candidate for the transparent in-package antennas design [21].…”

Section: Introductionmentioning

confidence: 99%

Millimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate

Zhang

Zhu

et al. 2020

IEEE Access

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SCHOTT D263T glass substrate is investigated for millimeter-wave (mm-wave) antenna-inpackage applications using integrated passive device (IPD) technology. For comparison, the ring-resonator method and transmission-line method are used to extract the dielectric constant (εr) of the glass substrate up to 67 GHz. The extracted results show good correlation between the two methods. Compared with the ring-resonator method, the transmission-line method requires higher measurement and simulation accuracies as the frequency decreases. Based on the extracted substrate data, a miniaturized Yagi-Uda dipole antenna operating at 60 GHz is designed, fabricated and measured. The measured results show that the antenna achieves a fractional impedance bandwidth (|S11| < −10 dB) of 57.1% (i.e. 36.4 to 65.5 GHz), and stable gains of 5.5±0.5 dBi from 40 to 67 GHz with the dimension of 3.4 × 4 mm 2. The simulated radiation efficiency is >90% from 45 to 67 GHz, and the measured results agree well with the simulations. INDEX TERMS Glass substrate, millimeter-wave (mm-wave), integrated passive device, ring-resonator method, transmission-line method, integrated antenna.

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Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions

Cited by 24 publications

References 19 publications

A Review of 5G Front-End Systems Package Integration

A Review of 5G Front-End Systems Package Integration

A 1 × 2 Taper Slot Antenna Array With Flip-Chip Interconnect via Glass-IPD Technology for 60 GHz Radar Sensors

Millimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate

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