2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2011
DOI: 10.1109/impact.2011.6117160
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Leadless IC package with a substrate produced by copper/nickel/copper-3-layer-clad material

Hironao Okayama
1
,
Kouji Nanbu
2
,
Teppei Kurokawa
3
et al.
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