2006
DOI: 10.1049/el:20061226
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LED array integrated with Si driving circuits for LED printer printhead

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Cited by 22 publications
(15 citation statements)
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“…4. We add a latch circuit, a control circuit and an MOSFET as a driver to control the brightness [8], [9]. There are different halftone patterns that drive the LED array; all control circuits can be integrated in a single chip [10].…”
Section: B Led Latch and Drivermentioning
confidence: 99%
“…4. We add a latch circuit, a control circuit and an MOSFET as a driver to control the brightness [8], [9]. There are different halftone patterns that drive the LED array; all control circuits can be integrated in a single chip [10].…”
Section: B Led Latch and Drivermentioning
confidence: 99%
“…A number of packaging technologies have been investigated including metal wiring, soldering, flip chip bonding, and anisotropic conductive film (ACF) bonding . Metal wiring and soldering are simple processes, but unsuitable for high resolution display . Flip chip bonding is preferred due to its short process time and reliable integration of microsized LEDs .…”
Section: Introductionmentioning
confidence: 99%
“…The integration of the light source and Si optical components is promising for future optical MEMS. In the integration of Si device and light source, monolithic and bonding technologies have been investigated [1,2]. Recently for GaN-based crystal growth on Si substrate, good crystals were reported [3,4].…”
Section: Introductionmentioning
confidence: 99%