Journal of Elec Materi
 2016
DOI: 10.1007/s11664-016-4885-7
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LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System

Yue Tang
1
,
Yung-Chang Hsu
2
,
E. J. Lin
3
et al.
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