Metal–organic
decomposition (MOD) precursor inks are emerging as the new route to
low-temperature deposition of highly conductive metals, owing to the
tunability of their decomposition. New methods of printing are being
investigated to help negate the progressive issues of the electronics
industry, not least the movement toward low-cost polymers and paper
substrates. Informed precursor design is crucial if achieving materials
capable of this is possible. In this work, the liquid MOD precursors,
dimethylethylamine alane (DMEAA) and trimethylamine alane
(TEAA), have been used to deposit a highly conductive
aluminum (Al) metal with resistivities in the range of 4.10 ×
10–5 to 5.32 × 10–7 Ω
m (mean electrical resistivity of 8 × 10–6 Ω
m, approximately 300 times more resistive than bulk Al metal), without
the need for an additional solvent, at low temperatures (100 and 120
°C), on a range of substrates including glass, polyimide, polyethylene
terephthalate, and paper. Conductive coatings have been analyzed using
X-ray diffraction, scanning electron microscopy, energy-dispersive
X-ray spectroscopy, X-ray photoelectron spectroscopy and resistivity
measurements; as a proof of concept, Al deposited on paper has been
used in an electrical circuit. Results indicate that DMEAA is a better precursor, producing more conductive films, which is
explained by its lower decomposition temperature and higher Al weight
loading, indicating potential for significant industrial application.