2011
DOI: 10.1016/j.ica.2010.05.048
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Lewis-base copper(I) formates: Synthesis, reaction chemistry, structural characterization and their use as spin-coating precursors for copper deposition

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Cited by 17 publications
(12 citation statements)
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“…The films contain traces of solvent, which was also observed previously in the case of Schiff base layers and [(nBu 3 P) 2 CuO 2 CH•HO 2 CH]. 28,59 This induces non-completed solidification of the complex solution during the spin coating process. The EDS results indicated the decrease of copper contents in the layers obtained at higher rotation speed, which is favorable for a thinner layer of the complex upon rotation speed increase.…”
Section: Thin Layer Studiessupporting
confidence: 64%
“…The films contain traces of solvent, which was also observed previously in the case of Schiff base layers and [(nBu 3 P) 2 CuO 2 CH•HO 2 CH]. 28,59 This induces non-completed solidification of the complex solution during the spin coating process. The EDS results indicated the decrease of copper contents in the layers obtained at higher rotation speed, which is favorable for a thinner layer of the complex upon rotation speed increase.…”
Section: Thin Layer Studiessupporting
confidence: 64%
“…The enhancement of the roughness is a consequence of the solvent lose and decomposition of the copper complex. Other authors observed the same effect in the case of silver and copper complexes [ 13 , 14 , 45 ]. After heating, the layers’ shape, structure, and composition were changed significantly.…”
Section: Resultssupporting
confidence: 65%
“…Due to a good solubility of the compounds, we have tested the applicability of these metal-organic compounds application in ‘wet’ coating methods. The literature data indicate that using spin- or dip- coating techniques and then heating the deposited precursors, metal or metal oxide layers at a thickness from a few tens up to several hundred nanometers can be obtained [ 13 , 14 ] in a low-cost process because they do not require complicated technical and hence, expensive equipment.…”
Section: Introductionmentioning
confidence: 99%
“…For the formation of copper and copper oxides several methods have been applied including electrochemical deposition,, thermal oxidation of copper, magnetron sputtering, spin‐coating, chemical beam epitaxy (CBE), atomic layer deposition (ALD), and chemical vapor deposition (CVD) , , …”
Section: Introductionmentioning
confidence: 99%
“…media, [15] solar cells, [16] sensors, [17] batteries, [18,19] and catalysis. [20][21][22] For the formation of copper and copper oxides several methods have been applied including electrochemical deposition, [23,24] thermal oxidation of copper, [25] magnetron sputtering, [26] spin-coating, [27][28][29][30][31] chemical beam epitaxy (CBE), [32] atomic layer deposition (ALD) [6,[33][34][35][36][37] and chemical vapor deposition (CVD). [8,10,[38][39][40] For the vacuum-based deposition of copper or copper oxide films the precursors can be classified in two groups: Copper(I) and copper(II) compounds, respectively.…”
Section: Introductionmentioning
confidence: 99%