2008
DOI: 10.1021/jo800491k
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Ligand-Free Copper-Catalyzed C−S Coupling of Aryl Iodides and Thiols

Abstract: A protocol for the copper-catalyzed aryl-sulfur bond formation between aryl iodides and thiophenols is reported. The reaction is catalyzed by a low amount (1-2.5 mol %) of readily available and ligand-free copper iodide salt. A variety of diaryl thioethers are synthesized under relatively mild reaction conditions with good chemoselectivity and functional group tolerance.

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Cited by 238 publications
(81 citation statements)
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“…Ligand free methods have also been reported [55][56][57][58]. Likely, the function of each ligand is in solubilizing the copper precatalyst and preventing aggregation of any active copper species in solution [59].…”
Section: %mentioning
confidence: 99%
“…Ligand free methods have also been reported [55][56][57][58]. Likely, the function of each ligand is in solubilizing the copper precatalyst and preventing aggregation of any active copper species in solution [59].…”
Section: %mentioning
confidence: 99%
“…[35] Prepared by reacting iodobenzene and 2-bromothiophenol in the presence of potassium carbonate and copper iodide in NMP according to a reported procedure. [36] Kugelrohr oven temp. was 117-122°C; p = 0.1 mbar.…”
mentioning
confidence: 99%
“…46 The reaction was catalyzed by CuI in presence of K 2 CO 3 base in N-methylpyrrolidinone at 100 ºC (Scheme 19). A variety of diaryl thioethers were synthesized with good functional group tolerance.…”
Section: Ligand Free Catalytic Systemsmentioning
confidence: 99%