The disinfection industry would greatly
benefit from efficient,
robust, high-power deep-ultraviolet light-emitting diodes (UV–C
LEDs). However, the performance of UV–C AlGaN LEDs is limited
by poor light-extraction efficiency (LEE) and the presence of a large
density of threading dislocations. We demonstrate high power AlGaN
LEDs grown on SiC with high LEE and low threading dislocation density.
We employ a crack-free AlN buffer layer with low threading dislocation
density and a technique to fabricate thin-film UV LEDs by removing
the SiC substrate, with a highly selective SF6 etch. The
LEDs (278 nm) have a turn-on voltage of 4.3 V and a CW power of 8
mW (82 mW/mm2) and external quantum efficiency (EQE) of
1.8% at 95 mA. KOH submicron roughening of the AlN surface (nitrogen-polar)
and improved p-contact reflectivity are found to be effective in improving
the LEE of UV light. We estimate the improved LEE by semiempirical
calculations to be 33% (without encapsulation). This work establishes
UV LEDs grown on SiC substrates as a viable architecture to large-area,
high-brightness, and high-power UV LEDs.