Following the significant
discovery of van der Waals (vdW) layered
materials with diverse electronic properties over more than a decade
ago, the scalable production of high-quality vdW layered materials
has become a critical goal to enable the transformation of fundamental
studies into practical applications in electronics. To this end, solution-based
processing has been proposed as a promising technique to yield vdW
layered materials in large quantities. Moreover, the resulting dispersions
are compatible with cost-effective device fabrication processes such
as inkjet printing and roll-to-roll manufacturing. Despite these advantages,
earlier works on solution-based processing methods (i.e., direct liquid-phase
exfoliation or alkali-metal intercalation) have several challenges
in achieving high-performance electronic devices, such as structural
polydispersity in thickness and lateral size or undesired phase transformation.
These challenges hinder the utilization of the solution-processed
materials in the limited fields of electronics such as electrodes
and conductors. In the meantime, the groundbreaking discovery of another
solution-based approach, molecular intercalation-based electrochemical
exfoliation, has shown significant potential for the use of vdW layered
materials in scalable electronics owing to the nearly ideal structure
of the exfoliated samples. The resulting materials are highly monodispersed,
atomically thin, and reasonably large, enabling the preparation of
electronically active thin-film networks via successful vdW interface
formation. The formation of vdW interfaces is highly important for
efficient plane-to-plane charge transport and mechanical stability
under various deformations, which are essential to high-performance,
flexible electronics. In this Perspective, we survey the latest developments
in solution-based processing of vdW layered materials and their electronic
applications while also describing the field’s future outlook
in the context of its current challenges.