Lignin: Renewable Raw Material for Adhesive

Gadhave, Ravindra V.; Srivastava, Shrray; Mahanwar, Prakash A.; Gadekar, Pradeep T.

doi:10.4236/ojpchem.2019.92003

Cited by 35 publications

(22 citation statements)

References 76 publications

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“…Different renewable biomass resources, such as proteins [ 58 , 59 , 60 ], starch [ 61 , 62 ], tannins [ 63 , 64 , 65 ], and lignin [ 9 , 66 , 67 , 68 , 69 ] have been used as sustainable raw materials for the development of bio-based adhesives for engineered wood panels.…”

Section: Introductionmentioning

confidence: 99%

Eco-Friendly, High-Density Fiberboards Bonded with Urea-Formaldehyde and Ammonium Lignosulfonate

et al. 2021

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The potential of producing eco-friendly, formaldehyde-free, high-density fiberboard (HDF) panels from hardwood fibers bonded with urea-formaldehyde (UF) resin and a novel ammonium lignosulfonate (ALS) is investigated in this paper. HDF panels were fabricated in the laboratory by applying a very low UF gluing factor (3%) and ALS content varying from 6% to 10% (based on the dry fibers). The physical and mechanical properties of the fiberboards, such as water absorption (WA), thickness swelling (TS), modulus of elasticity (MOE), bending strength (MOR), internal bond strength (IB), as well as formaldehyde content, were determined in accordance with the corresponding European standards. Overall, the HDF panels exhibited very satisfactory physical and mechanical properties, fully complying with the standard requirements of HDF for use in load-bearing applications in humid conditions. Markedly, the formaldehyde content of the laboratory fabricated panels was extremely low, ranging between 0.7–1.0 mg/100 g, which is, in fact, equivalent to the formaldehyde release of natural wood.

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Section: Introductionmentioning

confidence: 99%

Eco-Friendly, High-Density Fiberboards Bonded with Urea-Formaldehyde and Ammonium Lignosulfonate

et al. 2021

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“…The traditional cross-linking agents adipate, epicholorhydrin, and phosphorous oxychloride, are highly efficient, but have associated issues in relation to toxicity and environmental hazards. 230,226 Considerable research has been done into alternative cross-linking reagents, with lower cost, lower toxicity or less environmental damage, including: sodium trimetaphosphate; 230,226 epoxy silanes; 231,232 , citric acid; 233 glutaraldehyde, glyoxal and glycidyl esters; 227 and hexmethoxymethylamine. 4 In addition to starch, many other natural products can be used for adhesives.…”

Section: Sustainability and Natural Productsmentioning

confidence: 99%

Debondable adhesives and their use in recycling

et al. 2022

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“…As the stability of resulting PVA films is of utmost importance here, PAMPSA was introduced as an acid catalyst because polymers are more stable than small molecules in terms of dimensional stability. [37][38][39][40][41][42] To understand the influence of PAMPSA content, the molar ratio of PAMPSA to PVA was varied up to 18 mol% in the PVA:PAMPSA films which were subjected to thermal treatment at 70 and 110 °C. The chemical reactions in the PVA:PAMPSA films were investigated by Raman spectroscopy, p-polarized Fourier-Transform infrared (FT-IR) spectroscopy, and X-ray photoelectron spectroscopy (XPS).…”

Section: Introductionmentioning

confidence: 99%

Water‐Soluble Reactive Polymer Blends for Stable Memory Layers in Low‐Voltage Nonvolatile Organic Memory Transistors with High Mobility and Data‐Retention Characteristics

Lee

Kim

et al. 2022

Macromol. Rapid Commun.

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Here low‐voltage nonvolatile organic memory transistors, featuring high charge‐carrier mobility and outstanding data‐retention characteristics, by employing water‐soluble reactive polymer blends as a gate‐insulating memory layer are demonstrated. Blend films of poly(vinyl alcohol) (PVA) and poly(2‐acrylamido‐2‐methyl‐1‐propanesulfonic acid) (PAMPSA) (PVA:PAMPSA) are prepared from their aqueous solutions with various molar ratios of PAMPSA (0–18 mol%) and thermally annealed at 70 and 110 °C. Organic field‐effect transistors (OFETs) are fabricated by depositing poly(3‐hexylthiophene) (P3HT) channel layers on the thermally treated PVA:PAMPSA films. Results show that the hole mobility of OFETs is remarkably increased (≈294 times at 70 °C and ≈42 times at 110 °C) by adding only 2 mol% PAMPSA to the PVA films and further improved at 10 mol% PAMPSA (>11.7 cm2 V−1s−1 at 70 °C and >3.8 cm2 V−1 s−1 at 110 °C). The hysteresis characteristics are rather strengthened for the PVA:PAMPSA layers by annealing at 110 °C due to the formation of cross‐linking sites, even though the OFETs with the pristine PVA layers do almost lose hysteresis characteristics at 110 °C. The optimized OFETs with the PVA:PAMPSA layers (10 mol%, 110 °C) deliver excellent data retention characteristics during >10 000 memory cycles at a voltage range of −5 to +5 V.

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Lignin: Renewable Raw Material for Adhesive

Cited by 35 publications

References 76 publications

Eco-Friendly, High-Density Fiberboards Bonded with Urea-Formaldehyde and Ammonium Lignosulfonate

Eco-Friendly, High-Density Fiberboards Bonded with Urea-Formaldehyde and Ammonium Lignosulfonate

Debondable adhesives and their use in recycling

Water‐Soluble Reactive Polymer Blends for Stable Memory Layers in Low‐Voltage Nonvolatile Organic Memory Transistors with High Mobility and Data‐Retention Characteristics

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