2014 IEEE 36th International Telecommunications Energy Conference (INTELEC) 2014
DOI: 10.1109/intlec.2014.6972174
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Liquid cooling for mobile base station

Abstract: Thermal management of telecommunication equipments has become a major, and becomes even more critical issue as the power dissipated by the telecommunication equipments has dramatically increased. This article describes watercooling experiments made at two levels: at the cabinet level and at the rack level. Results are analyzed considering critical components temperature and energy efficiency. Water-cooling at the cabinet levelThis first study aims at evaluating a water-cooled telecommunication cabinet with two… Show more

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Cited by 2 publications
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“…Liquid cooling is already implemented and researched for cooling of enclosures of electronic devices [18] or direct cooling of the electronic chips by micro-channels [19]. Micro-channels are channels with hydraulic diameters ranging 10-200 μm fabricated for example by micromachining, sawing, or etching [20].…”
Section: Introductionmentioning
confidence: 99%
“…Liquid cooling is already implemented and researched for cooling of enclosures of electronic devices [18] or direct cooling of the electronic chips by micro-channels [19]. Micro-channels are channels with hydraulic diameters ranging 10-200 μm fabricated for example by micromachining, sawing, or etching [20].…”
Section: Introductionmentioning
confidence: 99%