Volume 1: Thermal Management 2015
DOI: 10.1115/ipack2015-48770
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Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

Abstract: The increasing addition of hot components on a single module comes with the challenge to cool the module. The cooling challenges are due to the presence of hot spots and the reduce space for attaching heat sinks to each component. The proposed cooling solution for a multi-chip module is a single vapor chamber shared amongst the multiple heat sources. Designing an application-optimized vapor chamber requires detailed understanding of the different processes occurring, including heat transfer by conduction, two-… Show more

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“…The design of large flat plate heat pipes can be found in the literature [14,[25][26][27]. The production of large scale heat pipes is primarily limited by their wick fabrication process.…”
Section: Introductionmentioning
confidence: 99%
“…The design of large flat plate heat pipes can be found in the literature [14,[25][26][27]. The production of large scale heat pipes is primarily limited by their wick fabrication process.…”
Section: Introductionmentioning
confidence: 99%