Liquid State Undercoolability and Crystal Growth Kinetics of Ternary Ni-Cu-Sn Alloys

Abstract

The liquid state undercoolability and crystal growth kinetics of ternary Ni-5%Cu-5%Sn and Ni-10%Cu-10%Sn alloys are investigated by the glass fluxing method. In these two alloys, experimental maximum undercoolings of 304K (0.18TL) and 286 K (0.17TL) are achieved and the dendritic growth velocities attain 39.8 and 25.1 m/s, respectively. The transition of morphology from coarse dendrite into equiaxed structure occurs and the grain size of the α (Ni) phase decreases remarkably when the undercooling increases. Both the lattice constant and microhardness increase obviously with the enhancement of undercooling. The enrichment of Cu and Sn solute contents reduces the dendritic growth velocity, while enhances the lattice constant and microhardness of α (Ni) phase.

Strain rate and cold rolling dependence of tensile strength and ductility in high nitrogen nickel-free austenitic stainless steel

“…The investigations on the metals and alloys have attracted extensive attention in the past years because of their good performance. [32][33][34][35][36][37][38][39] For the purpose of optimizing the microstructure and mechanical properties of the metals and alloys and extending their practical applications, it is of particular importance to analyze their plastic deformation behavior or stress-strain curves. One of the earliest attempts is the empirical mathematical equation proposed by Hollomon (termed as the Hollomon equation).…”