ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystem 2022
DOI: 10.1115/ipack2022-97416
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Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Abstract: Removal of heat is becoming a major challenge in today’s data centers. Computing-intensive applications such as artificial intelligence and machine learning are pushing data center to compute intensive systems, such as GPU, CPU, and switches to their extreme limits. Racks of IT can approach up to 100kW of heat dissipation challenging traditional data center designs for enterprises and cloud service providers. Direct-to-chip liquid cooling utilizing cold plates is becoming a common method of removing heat from … Show more

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