Liquidus projection and thermodynamic modeling of Sn–Zn–Cu ternary system

Huang, Yaohua; Chen, Sinn-wen; Chou, Chin-yi; Gierlotka, Wojciech

doi:10.1016/j.jallcom.2008.10.156

Cited by 32 publications

(9 citation statements)

References 30 publications

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“…Interdiffusion of metals to form these alloys is a process driven by the formation of more stable intermetallic bonds, and the binary system observed is consistent with the absence of known ternary alloys at this temperature 21 . It was shown that thanks to this soft annealing process, more uniform and less rough 22 Kesterite films can be obtained after the selenization step, leading to higher device efficiency 23 .…”

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confidence: 74%

“…A clear bimodal distribution of compositions is revealed as well, consistent with the compositional maps. The Sn-poor compositions centred on (0.34 Cu 2 , 0.15 Sn), (corresponding mostly to the phase 'CuZn(5%Sn) according to the 250°C phase diagram 21 ) are attributed to region 1 and phase 1 of the SEM image in figure 1b). The second type of composition detected is attributed to region 2.…”

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confidence: 95%

“…It is more Sn-rich and is compositionally broader than region 1 (from Sn 0.25 to Sn 0.5), which is consistent with the FIB cross section image (Fig 1d.ii) and EDS cross section analyses (supporting information, figure SI2) showing inclusions of a Cu-Zn containing alloy. This second region is in a three phase field lying mostly along the 'CuZn(5%Sn) and Sn (+2% Zn and 2% Cu) tie line with a minority of Cu 6 Sn 5 21 . In our case we expect a larger solubility of the Sn and Zn because here step (ii) is carried out at 350°C.…”

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confidence: 99%

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Understanding quaternary compound Cu₂ZnSnSe₄ synthesis by microscopic scale analyses at an identical location

et al. 2016

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'Understanding quaternary compound Cu2ZnSnSe4 synthesis by microscopic scale analyses at an identical location.', Journal of materials chemistry C., 4 (21). pp. 4626-4629. Further information on publisher's website:Publisher's copyright statement:Additional information: Use policyThe full-text may be used and/or reproduced, and given to third parties in any format or medium, without prior permission or charge, for personal research or study, educational, or not-for-prot purposes provided that:• a full bibliographic reference is made to the original source • a link is made to the metadata record in DRO • the full-text is not changed in any way The full-text must not be sold in any format or medium without the formal permission of the copyright holders.Please consult the full DRO policy for further details.

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Section: Please Do Not Adjust Marginssupporting

confidence: 74%

Section: Please Do Not Adjust Marginsmentioning

confidence: 95%

Section: Please Do Not Adjust Marginsmentioning

confidence: 99%

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Understanding quaternary compound Cu₂ZnSnSe₄ synthesis by microscopic scale analyses at an identical location

et al. 2016

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“…According to Lee et al [19], Gibbs free energy of the formation of the -Cu 5 Zn 8 phase is −212.10 kJ/mol (at 150 ∘ C), while Gibbs free energy of the formation of Cu 6 Sn 5 is −26.26 kJ/mol, which explains why the intermetallic phase from the Cu-Zn system is formed at the liquid Sn-Zn/solid Cu interface. At 250 ∘ C, in the Sn-Zn-Cu system the liquid phase (composition close to eutectic Sn-Zn) coexists in equilibrium with two intermetallic phases: -Cu 5 Zn 8 and -CuZn 4 [20,21]. In a study of Sn-Zn-Cu/Cu interfaces over short wetting time [22], we found that, at the earliest stage of the soldering process, liquid solder reacts with the Cu substrate and -CuZn 4 is formed.…”

Section: Resultsmentioning

confidence: 89%

Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

Pstruś

Gancarz

Fima

2017

Advances in Materials Science and Engineering

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The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250 ∘ C and reflow time of 3, 8, 15, 30, and 60 min. Wetting tests were performed at 230, 250, 280, 320, and 370 ∘ C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated. The -CuZn 4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas -Cu 5 Zn 8 was formed as a product of the reaction between -CuZn 4 and the Cu substrate. With increasing wetting time, the thickness of -CuZn 4 increases, while the thickness of -CuZn 4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.

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“…Figure 1 presents the results of the DSC analysis of SnZn0.5Ag1.0Cu and SnZn1.0Ag1.0Cu0.1Al alloys.The figure shows a distinct peak close to the melting temperature of eutectic Sn-Zn alloys (199°C) [22]. For the SnZn0.5Ag1.0Cu alloy, a second peak was observed at approximately 280°C, corresponding to liquid alloy with precipitations of AgZn 3 , CuZn 4 and Cu 5 Zn 8 , which could be expected based on the calorimetric study of ternary Sn-Zn-Ag and Sn-Zn-Cu alloys [23] as well as the recent assessment of the Sn-Zn-Cu system [22]. The same effect involving the appearance of a second peak with the addition of Ag to Sn9Zn0.45Al alloy was observed by Huang [24]; with increasing Ag content, the peak moved to higher temperatures (from 292.4°C for 0.5Ag to 357.7°C for 3.0Ag (wt.%)).…”

Section: Resultsmentioning

confidence: 97%

Characteristics Of Sn-Zn Cast Alloys With The Addition Of Ag And Cu

Gancarz¹,

Pstruś²

2015

Archives of Metallurgy and Materials

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CharaCterIstICs of sn-Zn Cast alloys wIth the addItIon of ag and Cu Charakterystyka odlanyCh stopów sn-Zn Z dodatkIem ag I CuThe aim of this work was to study the effects of Ag and Cu on the thermal properties and microstructure of Sn-Zn-AgCu cast alloys. Solders based on eutectic Sn-Zn containing 0.5 to 1.0 at.% of Ag and Cu were developed for wave soldering. DSC measurements were performed to determine the melting temperatures of the alloys. TMA and electrical resistivity measurements were performed between -50 and 150°C and between 30 and 150°C, respectively. Small precipitates of Cu5Zn8, CuZn4, and AgZn3 were observed in the microstructures, and their presence was confirmed by XRD measurements. The inclusion of Ag and Cu improved the electrical resistivity and increased the melting temperature, as well as the CTE, of the alloys. However, tests performed to measure the mechanical properties of the alloys demonstratedthat the addition of Ag and Cu caused the mechanical properties to decrease.Keywords: Sn-Zn-Ag-Cu, CTE, electrical resistivity, lead-free solders, XRD, microstructure of cast alloysCelem pracy było zbadanie wpływu dodatku Ag i Cu na właściwości termiczne i mikrostrukturę stopów sn-ZnAg-Cu. stopy lutownicze na bazie eutektyki sn-Zn zawierające od 0,5 do 1,0 % at. Ag oraz Cu zostały opracowane do lutowania falowego. Pomiary DsC wykonywano w celu określenia temperatury topnienia stopów. Badania współczynnika rozszerzalności liniowej przeprowadzono w temperaturach -50 i 150 °C, a oporu elektrycznego od 30 do 150 °C. W mikrostrukturze zaobserwowano drobne wydzielenia Cu5Zn8, CuZn4 i AgZn3, a ich obecność potwierdzono pomiarami XrD. Dodatek Ag i Cu do eutektyki snZn obniża rezystywność elektryczną, a podnosi temperaturę topnienia oraz współczynnik rozszerzalności liniowej stopów. Przeprowadzone badania mechaniczne odlanych stopów wykazały, że dodanie Ag oraz Cu spowodowało obniżenie właściwości mechanicznych.

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Liquidus projection and thermodynamic modeling of Sn–Zn–Cu ternary system

Cited by 32 publications

References 30 publications

Understanding quaternary compound Cu₂ZnSnSe₄ synthesis by microscopic scale analyses at an identical location

Understanding quaternary compound Cu₂ZnSnSe₄ synthesis by microscopic scale analyses at an identical location

Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces

Characteristics Of Sn-Zn Cast Alloys With The Addition Of Ag And Cu

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