As the only commercialized negative current collector,
copper (Cu)
foil possesses insurmountable applicational advantages as a lithium
metal anode (LMA) substrate. However, the successful usage of Cu foil
is limited by the poor Li affinity and crystal face variation, which
will lead to severe lithium dendrite growth and poor cyclability.
Herein, an industrial-popular ion implantation technique is first
adopted for Cu surface modification. With the high-energy implantations
of N+ plasma, the unique N-rich transition interface can
be formed, among which the lithiophilic Cu
x
N
y
with extended crystal domains can
have uniform Cu crystal faces and offer benefit for Li nucleation/deposition;
besides, the induced Li3N-rich SEI with high ionic conductivity
can support Li-ion transport kinetics, suppress Li dendrite growth,
and mitigate the side reaction to improve LMA stability. Consequently,
a uniform Li nucleation/deposition is achieved, with obviously enhanced
cycling stability and rate capability for the full cells. This technological
maturity ion implantation method can be readily extended to any non/metallic
ion species, or joint implantation of bi/multiple ions, and other
substrates, demonstrating a possible route to surmount the metal anode
challenges.