2014
DOI: 10.1088/0957-4484/25/14/145302
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Lithography and doping in strained Si towards atomically precise device fabrication

Abstract: We investigate the ability to introduce strain into atomic-scale silicon device fabrication by performing hydrogen lithography and creating electrically active phosphorus δ-doped silicon on strained silicon-on-insulator (sSOI) substrates. Lithographic patterns were obtained by selectively desorbing hydrogen atoms from a H resist layer adsorbed on a clean, atomically flat sSOI(001) surface with a scanning tunnelling microscope tip operating in ultra-high vacuum. The influence of the tip-to-sample bias on the li… Show more

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Cited by 12 publications
(10 citation statements)
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“…Additionally strain can drastically reduce valley oscillations of exchange coupling [18,19], which would play an important role in field control of qubits in strained environments. Recent progress towards atomically precise fabrication of donors in strained Si provides a testbed to demonstrate the advantages of strain in the realization of donor-based qubit devices [20]. Whilst the previous studies have exclusively considered strain or electric field effects on the quantum control of the donors, it is clear that through valley physics there is a subtle interplay between these two effects.…”
Section: Introductionmentioning
confidence: 99%
“…Additionally strain can drastically reduce valley oscillations of exchange coupling [18,19], which would play an important role in field control of qubits in strained environments. Recent progress towards atomically precise fabrication of donors in strained Si provides a testbed to demonstrate the advantages of strain in the realization of donor-based qubit devices [20]. Whilst the previous studies have exclusively considered strain or electric field effects on the quantum control of the donors, it is clear that through valley physics there is a subtle interplay between these two effects.…”
Section: Introductionmentioning
confidence: 99%
“…Normally for such devices, this in-situ preparation starts with a 10 h-anneal at 600 • C followed by a hightemperature flash annealing (typically above 1050 • C) to remove the native oxide 25 . However, this high temperature anneal cannot be performed here with a thin strained layer because it results in cross-hatching due to the strain variation across the wafer, which is notably unsuitable for STM lithography 33 . This high-temperature flash also incurs a high risk of dewetting the thin strained layer.…”
Section: Sample Fabrication and Structural Analysismentioning
confidence: 99%
“…In other words -by means of deterministic doping, e.g. using either ion implantation (SII) [29] or so called STM-Lithography [30].…”
Section: Future Stepsmentioning
confidence: 99%