2014
DOI: 10.1016/j.ijheatmasstransfer.2013.12.012
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Local measurement of flow boiling heat transfer in an array of non-uniformly heated microchannels

Abstract: As electronics packages become increasingly thinner and more compact due to size, weight, and performance demands, the use of large intermediate heat spreaders to mitigate heat generation nonuniformities are no longer a viable option. Instead, non-uniform heat flux profiles produced from chipscale variations or from multiple discrete devices are experienced directly by the ultimate heat sink. In order to address these thermal packaging trends, a better understanding of the impacts of non-uniform heating on two… Show more

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Cited by 41 publications
(17 citation statements)
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“…Flow maldistribution in parallel-channel two-phase heat sinks has been observed experimentally in various studies [8][9][10][11][12][13]. Maldistribution can have several causes: asymmetrical inlet header designs, differences in channel geometry or surface properties, non-uniform heating, and the non-monotonic nature of channel pressure drop as a function of flow rate.…”
Section: Flow Maldistributionmentioning
confidence: 99%
“…Flow maldistribution in parallel-channel two-phase heat sinks has been observed experimentally in various studies [8][9][10][11][12][13]. Maldistribution can have several causes: asymmetrical inlet header designs, differences in channel geometry or surface properties, non-uniform heating, and the non-monotonic nature of channel pressure drop as a function of flow rate.…”
Section: Flow Maldistributionmentioning
confidence: 99%
“…Flow maldistribution in parallel-channel two-phase heat sinks has been observed experimentally in various studies [7][8][9][10][11][12]. It can have several causes: asymmetrical inlet header designs, differences among the parallel channels in geometry or surface properties, non-uniform heating, or the non-monotonic nature of channel pressure drop as a function of flow rate.…”
Section: Introductionmentioning
confidence: 99%
“…Havacılık, savunma, uzay, tıp gibi yüksek teknoloji alanlarında kullanılan elektronik ekipmanların artan ısı akısı değerleri nispeten daha az yüzey sıcaklık artışının görüldüğü iki fazlı soğutma uygulamalarını cazip hale getirmektedir (Ritchey et al, 2014).…”
Section: Introductionunclassified