Localization of dielectric breakdown defects in multilayer ceramic capacitors using 3D X-ray imaging

Ingman, Jonny; Jormanainen, Joni; Vulli, Aleksi; Ingman, Jimmy; Maula, Kari; Kärkkäinen, Tommi J.; Silventoinen, Pertti

doi:10.1016/j.jeurceramsoc.2018.10.030

Cited by 15 publications

(5 citation statements)

References 4 publications

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“…The 3D model produced was utilized to analyse the structure of the corroded thick film resistor. This method has shown to be successful in displaying miniscule defects in electronic components such as multilayer ceramic capacitors [24].…”

Section: Analysis Methodsmentioning

confidence: 99%

Detection of Corrosion in Thick Film Resistors by X-Ray Imaging

et al. 2021

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In this article, a non-destructive method, using 2D X-ray imaging, to investigate corrosion defects in thick film resistors stressed by two different corrosion experiments, the single gas experiment and the flowers of sulphur experiment, is presented. In total, 370 devices under test (DUTs) were investigated, using the 2D X-ray imaging technique, of which 10 were imaged in a sequence of 2D X-ray images to evaluate the corrosion propagation. The observed underlying corrosion product was verified by using focused ion beam analysis combined with an energy dispersive X-ray spectroscopy. The presented 2D Xray imaging technique enables a fast and non-destructive method for accurately identifying corrosion and corrosion progression in thick film resistors. The presented imaging method was found to be especially suitable for supplier benchmarking purposes as well as for failure analysis of field returns as it allows for proper corrosion evaluation of surface mount thick film resistors while keeping the analyzed assembly intact.

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Section: Analysis Methodsmentioning

confidence: 99%

Detection of Corrosion in Thick Film Resistors by X-Ray Imaging

et al. 2021

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“…Class II MLCC lowfrequency large-signal excitation losses are then calculated upon the material-specific Steinmetz parameters and information on the MLCC geometry, namely the active area A and the layer thickness t. Note that the internal MLCC structure is today not disclosed by manufacturers and the tolerances associated with these features are not known to the authors. However, one could obtain this information by means of a Scanning Electron Microscopy (SEM), an energydispersive X-ray spectroscopy, or a Destructive Physical Analysis (DPA) with subsequent visual inspection [20], where DPA is preferred to investigate the electrode size. Therefore, the authors hope that this information in generic form may be available upon request from MLCC manufacturers in the future, as this modeling technique becomes more important for board designers and researchers.…”

Section: Design Examplementioning

confidence: 99%

iGSE-C_D—An Electric-/Displacement-Field Related Steinmetz Model for Class II Multilayer Ceramic Capacitors Under Low-Frequency Large-Signal Excitation

Menzi

Heller

Kerridge³

et al. 2023

IEEE Open J. Power Electron.

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Multilayer Ceramic Capacitors (MLCCs) are of paramount importance in electronics and ferroelectric Class II dielectrics enable outstanding energy-density values. However, the non-linear dielectric constant and associated low-frequency large-signal excitation losses of Class II MLCCs may cause critical overheating. A peak-charge based Steinmetz loss model entitled iGSE-C Q is known in literature and allows to accurately calculate MLCC low-frequency large-signal excitation losses under various operating conditions including biased and non-sinusoidal excitation voltage waveforms. Such a macroscopic iGSE-C Q model, however, is inherently limited to a specific MLCC, and in contrast to Steinmetz loss modeling for ferromagnetic inductor cores, the losses of other devices employing the same dielectric material cannot be predicted. Recent literature therefore proposed a microscopic and/or material specific MLCC Steinmetz Model entitled iGSE-CD which allows to calculate the losses of any MLCC of the same dielectric material based upon just a single set of Steinmetz parameters. However, due to the lack of information on the internal device geometry, the iGSE-CD could be verified only indirectly so far by means of a loss normalization based on the device capacitance and rated voltage. In this paper, we demonstrate the feasibility of a microscopic iGSE-CD MLCC loss model enabled by manufacturer data on the internal capacitor structure. The iGSE-CD is verified for two different MLCC series employing a conventional X7R dielectric and a novel Hiteca (with reduced non-linearity) Class II dielectric material with loss estimation error below 22 %. This error results due to component tolerances and is acceptable, especially when compared to the loss calculation based on the datasheet information which can be off by up to a factor of ten. The analysis of the Hiteca dielectric reveals a frequency behavior different to the X7R material, and is discussed in the Appendix of this paper.

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“…For a more thorough inspection, a capacitor can be chemically etched [15] or mechanically microsectioned [16] in order to reveal damage in the ceramic body, but these methods are slow, laborious, and destructive to the component. Recently, X-ray imaging methods with sufficient accuracy for detecting cracks [16] and dielectric breakdown defects [17] have been developed. However, these methods require manual interpretation of the X-ray images.…”

Section: A Detecting Damage In Mlccsmentioning

confidence: 99%

Nondestructive Acoustic Testing of Ceramic Capacitors Using One-Class Support Vector Machine With Automated Hyperparameter Selection

et al. 2020

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Localization of dielectric breakdown defects in multilayer ceramic capacitors using 3D X-ray imaging

Cited by 15 publications

References 4 publications

Detection of Corrosion in Thick Film Resistors by X-Ray Imaging

Detection of Corrosion in Thick Film Resistors by X-Ray Imaging

iGSE-C_D—An Electric-/Displacement-Field Related Steinmetz Model for Class II Multilayer Ceramic Capacitors Under Low-Frequency Large-Signal Excitation

Nondestructive Acoustic Testing of Ceramic Capacitors Using One-Class Support Vector Machine With Automated Hyperparameter Selection

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Localization of dielectric breakdown defects in multilayer ceramic capacitors using 3D X-ray imaging

Cited by 15 publications

References 4 publications

Detection of Corrosion in Thick Film Resistors by X-Ray Imaging

Detection of Corrosion in Thick Film Resistors by X-Ray Imaging

iGSE-CD—An Electric-/Displacement-Field Related Steinmetz Model for Class II Multilayer Ceramic Capacitors Under Low-Frequency Large-Signal Excitation

Nondestructive Acoustic Testing of Ceramic Capacitors Using One-Class Support Vector Machine With Automated Hyperparameter Selection

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iGSE-C_D—An Electric-/Displacement-Field Related Steinmetz Model for Class II Multilayer Ceramic Capacitors Under Low-Frequency Large-Signal Excitation