Localized and Mask-less Copper Deposition with Free-flow Jet Micro-Electrochemical Additive Manufacturing

Abstract

Micro-electrochemical additive manufacturing (μECAM) is reverse of electrochemical micro-machining (μECM) which is used for selective and localized deposition of material on a substrate. It can be used to manufacture small sized parts or deposit functional metal coatings on conductive surfaces. As the process is contactless and generates negligible joule heating, the deposited material is free from heat affected zones and has low internal stresses. This work presents a free-flow jet micro-electrochemical additive manufacturing (FJECAM) process that deposits material through a continuous stream of electrolyte. FJECAM can deposit accurate μm to mm scale features without the need for expensive masking and complex meniscus control as used in traditional μECAM configurations. This facilitates rapid surface modifications, surface coatings and deposition of 2D-2.5D shapes with high accuracy. In this paper, the deposition mechanism of copper (Cu) on stainless steel substrate (S.S.) during FJECAM is investigated through the characterization of surface topography and analysis of process current. The micro-deposits with FJECAM at different voltages and scan rates were observed to be without porosities and a minimum surface roughness of 0.38 ± 0.02 μm was achieved at a material deposition rate (MDR) of 16.06 μg/s which is 20 times higher than the traditionally used meniscus-confined μECAM (MECAM) at the same process parameters.

Effect of Magnetic Field on Maskless Localized Electrodepositing Three-Dimensional Microstructure of Nano Nickel Crystals

“…Characterized as a rapidly advancing microfabrication process, MLED demonstrates proficiency in crafting three-dimensional microstructures from metals such as copper, nickel, and gold, all within an ambient environment, and all without the necessity for intricate tooling [14]. Beyond the technical and economic merits inherent to plating technology, MLED stands as a contributor to reduced development durations and enhanced economic returns [15], particularly in the realms of post-processing and rapid prototyping applications [16,17]. Presently, the majority of investigative efforts surrounding MLED concentrate on understanding how varying parameters influence deposition rates and the characteristics of deposition structures under singular action fields, leaving the results and microstructural characteristics stemming from multi-action field depositions less explored [18].…”