Locally reinforced polymer-based composites for efficient heat dissipation of local heat source

Yuan, Chao; Li, Lan; Bin, Duan; Xie, Bin; Zhu, Yongming; Luo, Xiaobing

doi:10.1016/j.ijthermalsci.2015.11.015

Cited by 36 publications

(15 citation statements)

References 30 publications

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“…Kapitza resistance in PMCs mainly arises from two eects, namely the scattering at the interface between two phases, and the dierences between phonon spectra of different phases. An important factor in thermal transport of carbon based PMCs is the heat transport through percolation chains of llers [21]. Carbon based llers often fail to form such a network and, as a result, the eective thermal conductivity of the composite material is lower than expected [22].…”

Section: Introductionmentioning

confidence: 99%

Thermal transmittance in graphene based networks for polymer matrix composites

Bigdeli

Fasano

2017

International Journal of Thermal Sciences

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Graphene nanoribbons (GNRs) can be added as llers in polymer matrix composites for enhancing their thermo-mechanical properties. In the present study, we focus on the eect of chemical and geometrical characteristics of GNRs on the thermal conduction properties of composite materials. Congurations consisting of single and triple GNRs are here considered as representative building blocks of larger ller networks. In particular, GNRs with dierent length, relative orientation and number of cross-linkers are investigated. Based on results obtained by Reverse Non-equilibrium Molecular Dynamics simulations, we report correlations relating thermal conductivity and thermal boundary resistance of GNRs with their geometrical and chemical characteristics. These eects in turn aect the overall thermal transmittance of graphene based networks. In the broader context of eective medium theory, such results could be benecial to predict the thermal transport properties of devices made of polymer matrix composites, which currently nd application in energy, automotive, aerospace, electronics, sporting goods, and infrastructure industries.

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Section: Introductionmentioning

confidence: 99%

Thermal transmittance in graphene based networks for polymer matrix composites

Bigdeli

Fasano

2017

International Journal of Thermal Sciences

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“…It is worth noting that we mainly discuss the thermal management inside of the package and that outside of the package is not included in this section. This is because of the similarity in the outer packaging structure between QD-LEDs and pc-LEDs, and solutions for heat dissipation from the package to the ambient are widely studied in previous works [114][115][116][117].…”

Section: Enhancing the Reliability And Lifetime Of Qd-mentioning

confidence: 99%

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Xie

Qiu

Luo

2016

Journal of Electronic Packaging

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152

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Recent years, semiconductor quantum dots (QDs) have attracted tremendous attentions for their unique characteristics for solid-state lighting (SSL) and thin-film display applications. The pure and tunable spectra of QDs make it possible to simultaneously achieve excellent color-rendering properties and high luminous efficiency (LE) when combining colloidal QDs with light-emitting diodes (LEDs). Due to its solution-based synthetic route, QDs are impractical for fabrication of LED. QDs have to be incorporated into polymer matrix, and the mixture is dispensed into the LED mold or placed onto the LED to fabricate the QD–LEDs, which is known as the packaging process. In this process, the compatibility of QDs' surface ligands with the polymer matrix should be ensured, otherwise the poor compatibility can lead to agglomeration or surface damage of QDs. Besides, combination of QDs–polymer with LED chip is a key step that converts part of blue light into other wavelengths (WLs) of light, so as to generate white light in the end. Since QD-LEDs consist of three or more kinds of QDs, the spectra distribution should be optimized to achieve a high color-rendering ability. This requires both theoretical spectra optimization and experimental validation. In addition, to prolong the reliability and lifetime of QD-LEDs, QDs have to be protected from oxygen and moisture penetration. And the heat generation inside the package should be well controlled because high temperature results in QDs' thermal quenching, consequently deteriorates QD-LEDs' performance greatly. Overall, QD-LEDs' packaging and applications present the above-mentioned technical challenges. A profound and comprehensive understanding of these problems enables the advancements of QD-LEDs' packaging processes and designs. In this review, we summarized the recent progress in the packaging of QD-LEDs. The wide applications of QD-LEDs in lighting and display were overviewed, followed by the challenges and the corresponding progresses for the QD-LEDs' packaging. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art QD-LEDs' packaging and application technologies.

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“…Therefore, the QDs suffer from a high optical power density. While in the remote type, QDs film is away from the chip, thus suffering from a lower optical power density, and the chemical incompatibility between QDs surface ligands and phosphor-silicone gel can be released, by changing the polymeric environment of QDs layer [21][22][23][24][25][26][27]. Therefore, the remote packaging structure is widely utilized for fabricating WLEDs with both QDs and phosphor.…”

Section: Introductionmentioning

confidence: 99%

Structural optimization for remote white light-emitting diodes with quantum dots and phosphor: packaging sequence matters

Xie¹,

Chen²,

Hao³

et al. 2016

Opt. Express

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White light-emitting diodes (WLEDs) with quantum dots (QDs) and phosphor have attracted tremendous attentions due to their excellent color rendering ability. In the packaging process, QDs layer and phosphor-silicone layer tend to be separated to reduce the reabsorption losses, and to maintain the stability of QDs surface ligands. This study investigated the packaging sequence between QDs and phosphor on the optical and thermal performances of WLEDs. The output optical power and PL spectra were measured and analyzed, and the temperature fields were simulated and validated experimentally by infrared thermal imager. It was found that when driven by 60 mA, the QDs-on-phosphor type WLEDs achieved luminous efficiency (LE) of 110 lm/W, with color rendering index (CRI) of Ra = 92 and R9 = 80, while the phosphor-on-QDs type WLEDs demonstrated lower LE of 68 lm/W, with Ra = 57 and R9 = 24. Moreover, the QDs-on-phosphor type WLEDs generated less heat than that of another, consequently the highest temperature in the QDs-on-phosphor type was lower than another, and the temperature difference can reach 12.3°C. Therefore, in terms of packaging sequence, the QDs-on-phosphor type is an optimal packaging architecture for higher optical efficiency, better color rendering ability and lower device temperature.

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Locally reinforced polymer-based composites for efficient heat dissipation of local heat source

Cited by 36 publications

References 30 publications

Thermal transmittance in graphene based networks for polymer matrix composites

Thermal transmittance in graphene based networks for polymer matrix composites

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Structural optimization for remote white light-emitting diodes with quantum dots and phosphor: packaging sequence matters

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