Long-term stability of Cu/Pd nanoparticles and their feasibility for electroless copper deposition

Lo, Sylvia Hsiao-Yun; Wang, Yung-Yun; Wan, Chi‐Chao

doi:10.1016/j.electacta.2008.06.075

Cited by 5 publications

(4 citation statements)

References 33 publications

(35 reference statements)

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“…Recently, found long-term stability of Cu/Pd nanoparticles by using poly-vinylpyrrodione (PVP). In his study, acceptable activity and superior stability have been exhibited by the newly developed Cu/Pd colloidal system thus, indicating its capacity as an auxiliary for the prevailing Pd/Sn-based activator in PCBs [49]. The reduction of Cu(II) autocatalytically by formaldehyde from solutions having saccharose as the ligand initiates at a level of pH beyond 12, increases with an additional increase in pH, reaches a maximum value at pH 12.75, and then decelerates at higher pH values [50].…”

Section: Nanoscaled Films and Layersmentioning

confidence: 99%

Electroless Deposition of Nanolayered Metallic Coatings

Sudagar¹,

Tamilarasan²,

Sanjith³

et al. 2017

Nanoscaled Films and Layers

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Electroless metallic coating is referred as the deposition of a substrate material by the process of chemical or autocatalytic reduction of aqueous metal ions deposited to a substrate material without any external supply of power. Electroless nickel alloys are generally considered synonymous to the word "electroless coating" as ~90% of productions in industries are of this alloy coating. Rest of the electroless metallic coatings includes gold, copper, palladium, cobalt, silver, etc. These electroless metallic coatings (other than electroless nickel coatings) are also one of the vibrant areas in the field of materials properties and surface engineering research. From the year 2000 to till date, nearly 1000 SCI indexed research papers were published on this topic. However, no comprehensive studies about the recent progress on this topic were reported elsewhere so far. In this context, the present chapter aims to give a complete overview on various aspects of the rest of the electroless metallic nanocoatings/layer as a whole. More importance will be on the recent developments of the nanocharacteristics and future scopes.

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Section: Nanoscaled Films and Layersmentioning

confidence: 99%

Electroless Deposition of Nanolayered Metallic Coatings

Sudagar¹,

Tamilarasan²,

Sanjith³

et al. 2017

Nanoscaled Films and Layers

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“…The active catalyst acts as an electron carrier for the transfer of electrons from the reducing agent to the metal ions. Hence, the structure and composition of the catalyst can alter deposition rates and reaction kinetics . The most commonly used ELD method employs wet tin (Sn)-sensitization and Pd-activation steps.…”

Section: Introductionmentioning

confidence: 99%

“…Hence, the structure and composition of the catalyst can alter deposition rates and reaction kinetics. 6 The most commonly used ELD method employs wet tin (Sn)-sensitization and Pd-activation steps. Other activation methods can also be employed, such as ion implantation, spin-coating laser exposure, and dip coating.…”

Section: ■ Introductionmentioning

confidence: 99%

Fabrication of Bimetallic Nanostructures via Aerosol-Assisted Electroless Silver Deposition for Catalytic CO Conversion

Byeon

Kim

2014

ACS Appl. Mater. Interfaces

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Bimetallic nanostructures were fabricated via aerosol-assisted electroless silver deposition for catalytic CO conversion. An ambient spark discharge was employed to produce nanocatalysts, and the particles were directly deposited on a polytetrafluoroethylene substrate for initiating silver deposition to form Pd-Ag, Pt-Ag, Au-Ag bimetallic nanostructures as well as a pure Ag nanostructure. Kinetics and morphological evolutions in the silver deposition with different nanocatalysts were comparatively studied. The Pt catalyst displayed the highest catalytic activity for electroless silver deposition, followed by the order Pd > Au > Ag. Another catalytic activity of the fabricated bimetallic structures in the carbon monoxide conversion was further evaluated at low-temperature conditions. The bimetallic systems showed significantly higher catalytic activity than that from a pure Ag system.

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“…With the advancements in the synthesis of nanoparticles in the last decade, solutions containing Pd nanoparticles protected by an organic stabilizer can be prepared and used as new activators for ECD to interconnect printed circuit boards. 15,16 To reduce the consumption of expensive Pd during ECD, attempts were made to alloy Ag 17,18 or Cu 19,20 with Pd nanoparticles to form Pd-based alloy activators.…”

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confidence: 99%

Ag/Sn Nanoparticles Reduced by Tin(II) Pyrophosphate, Tin(II) Oxalate, and Tin(II) Sulfate for Catalyzing Electroless Copper Deposition

Liu¹,

Pan²,

Li³

et al. 2015

J. Electrochem. Soc.

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Different-sized Ag/Sn nanoparticles were prepared using various tin salts, including tin(II) pyrophosphate, tin(II) oxalate, and tin(II) sulfate, and applied as activators for electroless copper deposition. The transmission electron microscopy and X-ray photon electron spectroscopy data showed Ag nanoparticles of 8.2 and 10.2 nm were prepared and coated by SnO x when tin(II) sulfate and tin(II) oxalate were used, respectively. When tin(II) pyrophosphate was employed, 5.8 nm Ag nanoparticles with a thicker shell composed of SnO x and Sn 2 P 2 O 7 were obtained. Furthermore, a comparison of the activities and actual deposition rates of these three Ag/Sn nanoparticles was carried out by monitoring the deposition in situ with a quartz crystal microbalance (QCM) and measuring the surface morphology of the deposited layer with a field-emission scanning electron microscope (FE-SEM). The activities and deposition rates observed by QCM had the order Ag/Sn P2O7 > Ag/Sn SO4 > Ag/Sn C2O4 , which demonstrated that the size of the Ag nanoparticles controls the activity of electroless copper deposition (ECD), even in the presence of a thick Sn shell. However, the FE-SEM images showed that a thick shell influenced the uniformity of deposited Cu film. Therefore, among these three Ag/Sn nanoparticles, the nanoparticles reduced by tin(II) sulfate showed the best performance as an activator for ECD.The activation of a nonconductive substrate is a key issue in determining the characteristics of a deposited layer and the cost of electroless copper deposition (ECD) in industrial processes, including the fabrication of printed circuit boards 1-3 and ink-jet printable circuits. 4-6 Activation, which is a catalytic reaction, is induced by active colloids on the surface of substrates that are dipped into an electroless deposition bath. The active catalyst acts as an electron carrier in the transfer of electrons from the reducer to the metal ions. Accordingly, the activator can be regarded as increasing the deposition rate and improving the performance of advanced circuit processes. In the fabrication of printed circuit boards, Cu layers are deposited onto the side walls of holes in the circuit board via activator-catalyzed ECD. 1-3 The electronic circuits for an advanced process can be directly and rapidly deposited on a flexible polyimide substrate 7 or FR-4 plate 8 where an activator ink was previously coated using an ink-jet printing method.A typical activator is a Pd/Sn colloid solution, 9-13 which is prepared from a mixture of PdCl 2 and SnCl 2 in an acidic aqueous solution. 11,14 In the synthesis of Pd/Sn colloids, metallic Pd 0 can be reduced by Sn 2+ ions, which are simultaneously oxidized to Sn 4+ ions; therefore, catalytic Pd particles are surrounded and stabilized by an excess of Sn 4+ ions in aqueous solution. With the advancements in the synthesis of nanoparticles in the last decade, solutions containing Pd nanoparticles protected by an organic stabilizer can be prepared and used as new activators for ECD to interconnect print...

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Long-term stability of Cu/Pd nanoparticles and their feasibility for electroless copper deposition

Cited by 5 publications

References 33 publications

Electroless Deposition of Nanolayered Metallic Coatings

Electroless Deposition of Nanolayered Metallic Coatings

Fabrication of Bimetallic Nanostructures via Aerosol-Assisted Electroless Silver Deposition for Catalytic CO Conversion

Ag/Sn Nanoparticles Reduced by Tin(II) Pyrophosphate, Tin(II) Oxalate, and Tin(II) Sulfate for Catalyzing Electroless Copper Deposition

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