2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022
DOI: 10.1109/ectc51906.2022.00077
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Lossless High-speed Silicon Photonic MZI switch with a Micro-Transfer-Printed III-V amplifier

Abstract: We demonstrate an array of C-band high-speed silicon MZI switches with integrated III-V amplifiers on the imec iSiPP50G platform using micro-transfer printing. The integrated amplifiers exhibit 10 dB optical gain which enables lossless switching and facilitates cross-talk suppression of the switches.

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Cited by 4 publications
(3 citation statements)
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“…When the port count gets to 16 and above, the total incurred penalty could well make the switch incompatible with current short-reach unamplified link specifications. Therefore, optical gain is needed and SOAs can be integrated via either flip-chip bonding [17][18][19] or micro-transfer printing [20].…”
Section: B Results and Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…When the port count gets to 16 and above, the total incurred penalty could well make the switch incompatible with current short-reach unamplified link specifications. Therefore, optical gain is needed and SOAs can be integrated via either flip-chip bonding [17][18][19] or micro-transfer printing [20].…”
Section: B Results and Discussionmentioning
confidence: 99%
“…FCD effect offers nanosecond-scale switching time though it indeed comes at a price of higher loss and crosstalk due to the induced FCA [16]. Whilst gain integration has been widely demonstrated as a viable solution to tackle the switch insertion loss [17][18][19][20], coherent crosstalk remains trickier to handle and it adds penalty to the optical power budget creating a major signal integrity challenge. Efforts have been made in this respect by the use of nested switch elements [21][22][23] or dilated switch topologies [24], both of which trade off device complexity for improved crosstalk performance.…”
Section: Introductionmentioning
confidence: 99%
“…High-speed switches are one of the key building blocks in data centers and are nowadays often implemented in the electrical domain. In this section, the fabrication and performance of C-band lossless high-speed optical switches will be discussed [29]. The fabricated devices rely on a heterogeneous approach where the switching is implemented on imec's iSiPP50G platform while the optical gain is provided using µTP of III-V SOAs following the procedure discussed in section 3.…”
Section: Lossless Si Mzi Switch With Co-integrated Iii-v Amplifiermentioning
confidence: 99%