“…Importantly, the die clamp structure was found to retain its mechanical integrity and avoid significant degradation throughout all of the fabrication process steps that it was exposed to, i.e. sputtering, wet etching, dry etching and temperatures up to 200 • C, allowing the successful inclusion of a humidity sensor [23], a beam resonator [24], a radio-frequency (RF) switch [25] and a suspended diaphragm (which is a critical component for MEMS microphones, pressure sensors and ultrasonic transducers), as shown in figure 5.…”