Low contact-resistivity and high-uniformity Ni/Au ohmic contacts on Si nanomembranes grafted to Si substrates via low-temperature rapid thermal annealing

Kim, Ji-Soo; Gong, Jiarui; Lin, Wei; Lal, Shalini; Su, Xin; Vincent, Daniel; Cho, Sang June; Jie, Zhou; Min, Seunghwan; Kim, Dong‐Hyeok; Ma, Zhenqiang

doi:10.1016/j.mssp.2022.106988

Materials Science in Semiconductor Processing

2022

DOI: 10.1016/j.mssp.2022.106988

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Low contact-resistivity and high-uniformity Ni/Au ohmic contacts on Si nanomembranes grafted to Si substrates via low-temperature rapid thermal annealing

Ji-Soo Kim

Jiarui Gong

Wei Lin

et al.

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2023

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Passivation of CdTe/MgCdTe double heterostructure by dielectric thin films deposited using atomic layer deposition

Abbasi,

Qi,

Gong

et al. 2023

Journal of Applied Physics

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This work reports a study of the passivation effects of different dielectric thin films deposited on monocrystalline CdTe/MgCdTe double heterostructures (DHs) using atomic layer deposition (ALD). Enhanced photoluminescence intensity was observed in all DHs with surface passivation, and increased photogenerated carrier lifetime was observed in DHs with HfO2, TiO2, Al2O3, and TiN passivated CdTe/MgCdTe DHs. These results have demonstrated effective suppression of the undesired surface recombination of CdTe/MgCdTe DHs by dielectric thin films deposited via ALD.

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Passivation of CdTe/MgCdTe double heterostructure by dielectric thin films deposited using atomic layer deposition

Abbasi,

Qi,

Gong

et al. 2023

Journal of Applied Physics

View full text Add to dashboard Cite

show abstract

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Low contact-resistivity and high-uniformity Ni/Au ohmic contacts on Si nanomembranes grafted to Si substrates via low-temperature rapid thermal annealing

Cited by 1 publication

References 35 publications

Passivation of CdTe/MgCdTe double heterostructure by dielectric thin films deposited using atomic layer deposition

Passivation of CdTe/MgCdTe double heterostructure by dielectric thin films deposited using atomic layer deposition

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