Low-cost accelerometers: Two examples in thick-film technology

Crescini, Damiano; Marioli, D.; Taroni, A.

doi:10.1016/s0924-4247(97)80060-x

Cited by 26 publications

(14 citation statements)

References 6 publications

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“…Since the first cantilever-mass piezoresistive accelerometer reported by Roylance and Angell [1], this kind of micromachined sensor has been well developed [2]. The cantilever-mass accelerometers feature passable sensitivity but quite low resonant frequency, which results in a narrow frequency bandwidth [3][4][5]. Therefore, double-clamped beam-mass accelerometers are developed to increase the resonant frequency [5].…”

Section: Introductionmentioning

confidence: 99%

A high-performance micromachined piezoresistive accelerometer with axially stressed tiny beams

Huang¹,

Li²,

Song³

et al. 2005

J. Micromech. Microeng.

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A high-performance micromachined piezoresistive accelerometer, consisting of two axially stressed tiny beams combined with a central supporting cantilever, is developed for both much higher sensitivity and much broader bandwidth compared with conventional beam-mass piezoresistive accelerometers. With the pure axial-deformation scheme of the tiny beams, the developed accelerometer shows improvements in both sensitivity and resonant frequency. An analytic model is established for the pure axial-deformation condition of the tiny beams by adjusting the distance between the tiny beams and the central supporting cantilever. The specifications of the device, such as sensitivity and resonant frequency etc, are theoretically calculated. The analytic model is verified by using simulation of the finite element method (FEM), resulting in satisfactory agreement. Based on a figure of merit (the product of the sensitivity and the square of the resonant frequency), optimized design rules are obtained for the sensors of various measure-ranges from 0.25g to 25 000g. The accelerometers are fabricated by using silicon bulk micromachining technology. The formed 2.5g devices are characterized with a typical sensitivity of 106 mV/5 V/g and first mode resonant frequency of 1115 Hz. The testing results agree well with the design, thereby verifying the high performance of the proposed accelerometer. The developed sensors with the axially stressed tiny-beam scheme show obviously improved specifications, compared with previously published results.

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Section: Introductionmentioning

confidence: 99%

A high-performance micromachined piezoresistive accelerometer with axially stressed tiny beams

Huang¹,

Li²,

Song³

et al. 2005

J. Micromech. Microeng.

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show abstract

“…Normally, accelerometers based on the piezoresistive technique are fabricated with stiff flexures (the piezoresistors are diffused or implanted) and a proof mass. 19) To achieve better signal output, most piezoresistive accelerometers use out-of-plane vibration. However, to release the device from the back, the expensive deep reactive-ion etching (DRIE) process is required.…”

Section: Introductionmentioning

confidence: 99%

Analytical and Experimental Study on Sensitivity of Planar Piezoresistive Vibration Sensor

Zhang

Takagi

et al. 2013

Jpn. J. Appl. Phys.

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We are engaged in developing a planar high-sensitivity piezoresistive vibration sensor with lower process cost and fewer package difficulties. For the pursuit of high sensitivity, the design and optimization of the sensor structure are studied together via a theoretical principle approach and finite-element method (FEM) analysis. The effects of the vibration sensor dimensions, including the solid width and length of flexure, the structure thickness, and the piezoresistor width, have been analyzed comprehensively. Design guidelines are presented for the fabrication of vibration sensors, and the sensitive position of the piezoresistor on a flexure beam is obtained for resolution optimization. To calculate the relative resistance changes in one-beam flexure, the theoretical approach and the FEM simulation are used. The results of the two methods agree well, the relative error being only 3.8%. Moreover, dynamic measurement of the structure of the prototype vibration sensor is implemented. The calculated and measured results of the relative displacement between the proof mass and substrate are in good agreement, which also demonstrated the FEM-based design to be reasonable.

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“…Hence, they can work properly if they are excited by high or low frequency changed accelerations. Sensors can be designed to measure acceleration in one (Crescini et al , 1996; Neubert et al , 2008) or in three axes (Plaza et al , 1998; Kunz et al , 2001). Modern microelectronic accelerometers are typically fabricated using silicon technology (Beeby et al , 2001; Hindrichsen et al , 2009a, b).…”

Section: Introductionmentioning

confidence: 99%

Three axial low temperature cofired ceramic accelerometer

Jurków

2013

Microelectronics International

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Purpose -The paper aims to present numerical modeling and technology of a very first three axial low temperature cofired ceramics (LTCC) accelerometer. Design/methodology/approach -Low temperature cofired ceramics technology was applied in the fabrication process of the novel device. The numerical modeling was used to predict the properties of the accelerometer, moreover, design of the experiment methodology was used to reduce time of simulation and to get as much as information from the experiment as possible. Findings -The low temperature cofired ceramics make it possible to fabricate three axial accelerometer.Research limitations/implications -The presented device is just a first prototype. Therefore, further research work will be needed to improve structural drawbacks and to analyze precisely the device reliability and parameters repeatability. Practical implications -The device presented in the paper can be applied in systems working in a harsh environment (high temperature and humidity). Ceramic sensors can withstand temperatures up to 6008C. Originality/value -This paper presents novel three axial LTCC accelerometer.

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Low-cost accelerometers: Two examples in thick-film technology

Cited by 26 publications

References 6 publications

A high-performance micromachined piezoresistive accelerometer with axially stressed tiny beams

A high-performance micromachined piezoresistive accelerometer with axially stressed tiny beams

Analytical and Experimental Study on Sensitivity of Planar Piezoresistive Vibration Sensor

Three axial low temperature cofired ceramic accelerometer

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