2006
DOI: 10.1117/12.660141
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Low-cost plastic micro-optics for board level optical interconnections

Abstract: One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. In our labs at the Vrije Universiteit Brussel we are therefore focusing on the continuous development of a rapid prototyping technology for micro-optical interconnect modules, which we call Deep Proton Writing (DPW).The s… Show more

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“…However, this technique produces a relatively high percentage of defective parts, leading to a high manufacturing cost. We introduce deep proton writing (DPW) as a candidate technology for the rapid prototyping of a wide variety of micro-optical, micro-mechanical and micro-fluidic components with plenty of applications in photonics (Debaes et al, 2005;Thienpont et al, 2001). Its concept is somewhat comparable to LIGA X-ray lithography (Ehrfeld & Schmidt, 1998), but it uses ions rather than electromagnetic radiation to structure the resist sample.…”
mentioning
confidence: 99%
“…However, this technique produces a relatively high percentage of defective parts, leading to a high manufacturing cost. We introduce deep proton writing (DPW) as a candidate technology for the rapid prototyping of a wide variety of micro-optical, micro-mechanical and micro-fluidic components with plenty of applications in photonics (Debaes et al, 2005;Thienpont et al, 2001). Its concept is somewhat comparable to LIGA X-ray lithography (Ehrfeld & Schmidt, 1998), but it uses ions rather than electromagnetic radiation to structure the resist sample.…”
mentioning
confidence: 99%