Low-Cost Production of Large RBSC Components by Plastic Forming Processes

Lee, Hai Won; Jun, Hyung-Woo; Kim, J.; Song, Hyun Hoon; Ha, Jung‐Hong

doi:10.4028/www.scientific.net/kem.247.95

Cited by 2 publications

(1 citation statement)

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“…Reaction-bonded silicon carbide (RBSC) components for semiconductor furniture are the best candidate to apply near-net-dimension fabrication for economical production of large components of relatively complex shapes [1]. Powder thermoset molding has been introduced by the authors to fabricate large RBSC components such as radiant tubes and wafer carriers for semiconductor processes in near-net-dimension by employing thermosetting resin as a binder phase as well as additional carbon source [2,3].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Large Ceramic Components with Controlled Microstructure by Powder Thermoset Molding

Lee

Kim

Lee

et al. 2006

KEM

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Thermoset molding in wet and dry state was successfully employed to fabricate high strength reaction bonded silicon carbide (RBSC) ceramics. Granule transfer molding (GCM) was developed to prevent segregation of component particles and binder phase in wet state, while granule compression molding was applied in dry state to fabricate green compact with significant variation of compaction ratio. Low-fill density granules with mixing homogeneity were critical for promoting lateral deformation of granules during consolidation. In addition, anodic performance of Ni-YSZ anode was significantly enhanced by replacing solid fugitive phase with viscoelastic fugitive phase used as binder in thermoset molding.

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Section: Introductionmentioning

confidence: 99%