Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature

Zhu, Yongxin; Li, Xiaoyan; Gao, Ruiting; Wang, Chao

doi:10.1016/j.microrel.2014.08.016

Cited by 31 publications

(7 citation statements)

References 26 publications

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“…The solder strength working group in the JSMS investigated the fatigue strength of both the Sn-37Pb and Sn-3.5Ag solders and showed that the fatigue lives of the solders became shorter with increasing in the temperature even though the applied strain amplitude was the same (JSMS, 2001b). The same temperature effect on the fatigue lives of solder alloys has also been reported by the other researchers, e.g., Tang et al (2013) using Sn-3.5Ag-0.7Cu solder and Zhu et al (2014) using Sn-3.0Ag-0.5Cu solder. This phenomenon could have been caused by the increase of the creep strain amplitude generated in a loading cycle because the creep deformation occurs easily with increasing in the temperature.…”

Section: Availability Of Creep Strain Amplitude For Estimating Fatigusupporting

confidence: 79%

Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading

Ohguchi

Sasaki

Yuze

et al. 2019

Mechanical Engineering Journal

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Electronic parts having different coefficients of thermal expansion are mounted to electronic circuit boards by soldering. Then, solder joints are subjected to cyclic inelastic deformation when temperature change occurs repeatedly during use of electronic equipment. As the cyclic deformation causes low-cycle fatigue failure of solder joints, the fatigue strength of solder alloys must be clarified to ensure the strength reliability of an electronic circuit board. Especially, the current electronic circuit board must employ lead-free solders, and therefore many researchers have investigated the fatigue characteristics of lead-free solders. For example, Kariya and Otsuka (1998) conducted the fatigue tests of Sn-3.5%Ag-Bi (0, 2, 5, 10%) solders and discussed the effect of Bi addition on the fatigue properties of Sn-3.5%Ag solder. Kanchanomai et al. (2003) carried out the low cycle fatigue tests on 96.5Sn-3.5Ag solder with different frequencies to discuss the influence of frequency on the low cycle fatigue behavior. Kobayashi et al. (2018) investigated the fatigue properties of Sn-5Sb and Sn-10Sb solders using the miniature size specimens. The fatigue tests using solder joint specimens have been also conducted. George et al. (2015) conducted temperature cycling test using board type specimens on which ceramic leadless chips were mounted using 3 different kinds of lead-free solders and a lead-containing solder to discuss the fatigue life prediction method for the solder joints under cyclic thermal loading. Mustafa et al. (2016) prepared the Iosipescu shear specimens made by soldering two copper parts with Sn-1.0Ag-05Cu solder and performed

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Section: Availability Of Creep Strain Amplitude For Estimating Fatigusupporting

confidence: 79%

Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading

Ohguchi

Sasaki

Yuze

et al. 2019

Mechanical Engineering Journal

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“…Considering fatigue results obtained with other lead‐free materials (Sn‐Ag, SAC), under similar testing conditions, 96.5Sn3.5Ag, SAC305 34 and SAC387 32 solders show a lower fatigue strength compared with the InnoLot solder as shown in Figure 10. One explanation for this difference is the more conservative lifetime criterion used for the first solders that correspond to 25% load drop 35 .…”

Section: Resultsmentioning

confidence: 82%

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Tao

Benabou

et al. 2020

Fatigue Fract Eng Mat Struct

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Low-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different temperatures and strain amplitudes. The experiments show a decline of the load capacity of the solder alloy with the number of loading cycles. The fatigue life of the solder is also decreased by the level of imposed temperature. The temperature-modified Coffin

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“…Sn3.0Ag0.5Cu (96.5 wt.% Sn, 3.0 wt.% Ag, and 0.5 wt.% Cu) solder was employed in this research because it is considered as the most promising candidate for tin-lead solders [21]. The detailed fabrication process of solder joint is listed in our previous research [22].…”

Section: Methodsmentioning

confidence: 99%

A new creep–fatigue life model of lead-free solder joint

Zhu

Wang

et al. 2015

Microelectronics Reliability

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Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature

Cited by 31 publications

References 26 publications

Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading

Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

A new creep–fatigue life model of lead-free solder joint

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