“…Due to the reduction of threading dislocation density by the post-growth annealing, the dark leakage current is reduced to ∼20 mA/cm 2 at the reverse bias of 1 V. As summarized in Fig. 8(c), the dark leakage current tends to decrease with decreasing the threading dislocation density in Ge [23,30,31,32,33]. However, the high-temperature annealing to reduce the dislocation density could be eliminated from the viewpoint of compatibility with the CMOS process for electronic circuits, otherwise Ge layers need to be formed at the beginning of front-end process, causing a drastic change in the existing CMOS process.…”