Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages

Kohl, Paul A.

doi:10.1146/annurev-chembioeng-061010-114137

Cited by 116 publications

(90 citation statements)

References 102 publications

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“…[42] Many dielectric polyimides have been created, and the original motivation for the development of polyimide dielectrics was as a lowcost alternative to on-chip silicon dioxide with high T g , high modulus, and low dielectric constant as compared with silicon dioxide. [43] The dielectric constants (ɛ r ) of the prepared fluorinated polyimides were determined in the range of 2.60-2.76, as shown in Table 4, which are lower than the non-fluorinated polyimides such as PMDA-ODA (3.16), [44] PI-POSS (2.65-3.22) [45], and PI/PSSQ (2.79-3.61) [46] nanocomposites, but comparable with other fluorinated polyimides. [18,19,23] The high electrical insulating and low dielectric constants of the fluorinated polyimides are mainly attributed to the high fluorine loadings in the polyimide backbones.…”

Section: Dielectric Properties and Water Absorption Of Pieismentioning

confidence: 99%

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Ghaemy

Berenjestanaki

Bazzar

2013

Designed Monomers and Polymers

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A photoactive highly fluorinated diamine was synthesized, characterized, and used in preparation of structurally confirmed poly(imidazole-ether-imide)s (PIEIs). These polymers showed excellent solubility, moderate viscosities, good thermal stability (T g = 230-280°C, T i = 390-435°C, T 10% = 480-510°C), low dielectric constant (2.60-2.76), and water absorptions. The PIEIs films showed highly optical transparency with light transmittance at 550 nm of as high as 80% and cutoff wavelength of as low as 390 nm. These polymers exhibited fluorescence emission peaks around 410-490 nm with the quantum yields measured in solution varied from 12 to 32%.

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Section: Dielectric Properties and Water Absorption Of Pieismentioning

confidence: 99%

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Ghaemy

Berenjestanaki

Bazzar

2013

Designed Monomers and Polymers

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“…However, conventional PI dielectrics usually have k values around 3.0, which cannot meet the rapid development of ULSI assembly. For example, according to the prediction of International Technology Roadmap for Semiconductors (ITRS), by 2016, a k value below 2.0 at 1 GHz and a dielectric loss below 0.003 have to be met for the ILDs [7]. It has been proven that the common methodologies reducing the k values for conventional PIs (k ≈ 3.0), including introduction of substituents with low molar polarizability (fluorinated groups, alicyclic groups, etc.)…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of flexible and high-temperature resistant polyimide aerogel with ultra-low dielectric constant

Zhang¹,

Liu²,

Shen³

2016

Express Polym. Lett.

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Abstract.A polyimide (PI) aerogel with excellent combined thermal and dielectric properties was successfully prepared by the polycondensation of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 5-amino-2-(4-aminophenyl)benzoxazole (APBO) and octa(amino-phenyl)silsesquioxane (OAPS) crosslinker, followed by a supercritical carbon dioxide (scCO 2 ) drying treatment. The developed PI aerogel exhibited an ultra-low dielectric constant (k) of 1.15 at a frequency of 2.75 GHz, a volume resistivity of 5.45·1014 Ω·cm, and a dielectric strength of 132 kV/cm. The flexible PI aerogel exhibited an openpore microstructure consisting of three-dimensional network with tangled nanofibers morphology with a porosity of 85.6% (volume ratio), an average pore diameter of 19.2 nm, and a Brunauer-Emmet-Teller (BET) surface area of 428.6 m 2 /g. In addition, the PI aerogel showed excellent thermal stability with a glass transition temperature (T g ) of 358.3°C, a 5% weight loss temperature over 500°C, and a residual weight ratio of 66.7% at 750°C in nitrogen.

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“…14 The stiffness was defined as the initial slope of the unloading curve, and the reduced modulus (E r ) was calculated using Equation 4, where β is a geometrical constant. The elastic modulus of the film (E f ) was calculated using Equation 5, where E i is the elastic modulus of the diamond tip (2015) (1140 GPa), and ν f and ν i are the Poisson's ratios of the film and tip, respectively.…”

Section: Methodsmentioning

confidence: 99%

Improved Mechanical Properties of Chemically Amplified, Positive Tone, Polynorbornene Dielectric

Mueller

Schwartz

Sutlief

et al. 2014

ECS J. Solid State Sci. Technol.

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The mechanical properties of an aqueous developed, chemically amplified, polynorbornene-based permanent dielectric have been investigated. The previously reported hexafluoroisopropanol norbornene and tert-butyl ester norbornene copolymer has been modified via two routes to improve the mechanical properties of the polymer and enable thick-film deposition. First, a third monomer, butyl norbornene (ButylNB) was added to the polymer backbone. The inclusion of 24 mol% ButylNB lowered the elastic modulus from 2.64 to 2.35 GPa and raised the dielectric constant from 2.78 to 3.48. The second approach added a low molecular weight, plasticizing additive in the copolymer formulation. Many additives were immiscible with the resin or did not affect the mechanical properties. Trimethyololpropane ethoxylate (TMPEO) was found to be a miscible additive that improved mechanical properties and could participate in crosslinking the final dielectric material. TMPEO interacted with the PAG, lowering its decomposition temperature. An optimal formulation and processing scheme were determined. A formulation with 10 pphr TMPEO was measured to have a dielectric constant of 2.94, an elastic modulus of 1.95 GPa, a sensitivity at 365 nm of 175 mJ/cm 2 , and a contrast of 4. Photo-definable, permanent, low-k dielectrics are widely used in the fabrication of microelectronic devices and packages.1-5 These dielectrics electrically isolate the interconnect and mechanically stabilize the structures for the life of the device. On integrated circuits, organic dielectrics can be used for interlayer isolation and/or the stress buffer layer on top of the device. Stress buffer layers protect the top surface of the chip and can mitigate mechanical failures that arise from a mismatch of the coefficient of thermal expansion between the chip and package during thermal cycling. In microelectronics packages, low-k dielectrics can be used in the buildup layers, electrically separating the electrical conductors. Low permittivity is critical for use in these applications, as it affects device performance, energy loss, and signal integrity.Photo-definability is an attractive property for permanent polymeric dielectrics. The ability to directly pattern the dielectric by photolithographic techniques mitigates the need for a separate photoresist and pattern transfer steps. This can lower the overall fabrication cost and reduce the number of individual process steps.2 For stress buffer and redistribution applications, positive tone photo-definable dielectrics are more desirable than negative tone ones because the lithographic mask is mostly opaque mask and less prone to transfer particle defects. Also, holes and lines in positive tone materials exhibit sloped sidewalls (opening wider at the top) which is beneficial for void-free plating of the copper interconnects. Aqueous developability is another attractive property, as it mitigates the need for environmentally harmful organic solvent developers. Further, the dielectric should exhibit high sensitivity and contrast ...

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Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages

Cited by 116 publications

References 102 publications

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Organosoluble, thermally stable and low dielectric constant fluorinated polyimides containing 2,4,5-triphenylimidazole moiety in the main chains

Synthesis and characterization of flexible and high-temperature resistant polyimide aerogel with ultra-low dielectric constant

Improved Mechanical Properties of Chemically Amplified, Positive Tone, Polynorbornene Dielectric

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