Low dielectric material for multilayer printed wiring boards

Takahashi, Akio; Nagai, Atsushi; Mukoh, Akio; Wajima, M.; Tsukanishi, K.

doi:10.1109/33.62560

Cited by 16 publications

(6 citation statements)

References 5 publications

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“…Bismaleimide resins are preferred in a wide range of applications from commodity materials to applications in hi‐tech aerospace industries, such as multiplayer printed circuit boards for large‐scale computers,1, 2 advanced composites,3, 4 structural adhesives, and potting resins,5 because of their high thermal stability, hot–wet strength, and fatigue resistance.…”

Section: Introductionmentioning

confidence: 99%

Isothermal differential scanning calorimetry study of the cure kinetics of a novel aromatic maleimide with an acetylene terminal

Luo¹,

Wei²,

Li³

et al. 2008

J of Applied Polymer Sci

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An isothermal differential scanning calorimetry (DSC) study on the cure kinetics was performed on N-(3-acetylenephenyl)maleimide (3-APMI) monomer to determine a suitable cure model. The 3-APMI monomer reported in our prior article was a novel aromatic maleimide monomer with an acetylene terminal that would be an ideal candidate for heat-resistant composites. The isothermal DSC study was carried out in the temperature range 150-2008C. Although the cure temperatures were different, the shapes of the conversion curves were similar, and all of the cure reactions could be described by an nthorder kinetic model. In particular, the cure reaction at the initial stage was a first-order kinetic reaction. The cure kinetic parameters of the 3-APMI monomer, including the reaction model, activation energy, and frequency factor, were determined. This information was very useful for defining the process parameters, final properties, and quality control of the cured 3-APMI monomer.

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Section: Introductionmentioning

confidence: 99%

Isothermal differential scanning calorimetry study of the cure kinetics of a novel aromatic maleimide with an acetylene terminal

Luo¹,

Wei²,

Li³

et al. 2008

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

“…The reasons for their success in the electronic industry are their excellent thermal, mechanical and electrical properties associated with their ease of application, good adhesion and a comparatively low dielectric constant [1,2]. Typically, dielectric constants of electronics packaging material should be low (between 2.0 and 3.5) over a very wide frequency range to reduce the delay time and shorten transmission length for improvement of processing speed in large scale computers [3,4,5]. Several important properties must be considered for packing materials such as low K, thermal stability and processing properties [5].…”

Section: Introductionmentioning

confidence: 99%

“…Typically, dielectric constants of electronics packaging material should be low (between 2.0 and 3.5) over a very wide frequency range to reduce the delay time and shorten transmission length for improvement of processing speed in large scale computers [3,4,5]. Several important properties must be considered for packing materials such as low K, thermal stability and processing properties [5]. However, many of the conventional polyimide resins and bismaleimide-based resins have high dielectric constant i.e.…”

Section: Introductionmentioning

confidence: 99%

“…The dielectric constant of the polymer can be calculated by the Clausius-Mossotti equation [5]. Because aliphatic-ether group containing -CH 2 -repeating unit as main chain can offer polymer a low dielectric constant, this paper will study the modified BMI containing aliphatic-ether chain as backbone.…”

Section: Introductionmentioning

confidence: 99%

“…The bismaleimides containing oxyalkylene linkages has been reported [6], BMI in this paper contain benzene ring between maleimide groups. Because benzene ring would increase the value of the dielectric constant [5], the benzene ring is not introduced into the modified BMI in this paper. BMI with -CH 2 -repeating unit could have a low dielectric constant and decreased brittleness if the backbone chain is long enough.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Synthesis and Characterization of the Bismaleimides Containing Aliphatic-ether Chain for Microelectronics Application

2006

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This project aims to develop and characterize a series of bismaleimide (BMI) polymers based on maleic anhydride and aliphatic-ether diamines. The effects of varying the chain length of aliphatic-ether diamines on the resultant bismaleimide systems were evaluated so that their suitability for microelectronics applications could be evaluated. The synthetic reaction and properties of the bismaleimide materials were investigated using Fourier Transform Infrared Spectroscopy (FTIR), Differential Scanning Calorimetry (DSC), ThermoGravimetric Analysis (TGA), Dielectric Thermal Analysis (DEA) and rheometry. Results showed that thermal, dielectric and rheological properties were all affected by the main chain length of BMI. The magnitude of the dielectric constant at 100 kHz increases with the increasing chain length. The curing peak temperature, curing heat and degradation temperature of BMI, all decrease with the increasing chain length.

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Triazine networks modified with monofunctional reactive cyanate ester monomers

Papathomas

Wang

1992

J of Applied Polymer Sci

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SYNOPSISThe preparation of cyanate ester thermosetting resins by coreacting a fluorinated bisphenol A dicyanate (6F-BADCY) monomer with a monofunctional reactive cyanate, namely, the dinonyl phenol cyanate (DNPC) , is described in this paper. Our objective in this study was to modify the 6F-BADCY system with reactive diluents of a nonpolar nature and produce matrix resins processable at FR-4 epoxylike conditions. By introducing the monofunctional cyanate as a reactive diluent, it is expected that the molar crosslink density of the resulting network will be reduced. Highly branched triazine polymers will result from this approach. Dinonyl phenol cyanate was quantitatively synthesized by reacting dinonyl phenol with cyanogen bromide in the presence of triethylamine.

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Low dielectric material for multilayer printed wiring boards

Cited by 16 publications

References 5 publications

Isothermal differential scanning calorimetry study of the cure kinetics of a novel aromatic maleimide with an acetylene terminal

Isothermal differential scanning calorimetry study of the cure kinetics of a novel aromatic maleimide with an acetylene terminal

Synthesis and Characterization of the Bismaleimides Containing Aliphatic-ether Chain for Microelectronics Application

Triazine networks modified with monofunctional reactive cyanate ester monomers

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