Low dielectric post-cured benzocyclobutene-functionalized fluorine-containing polyimide material

He, Jianhao; Wu, Xueliang; Cheng, Yuanrong

doi:10.1016/j.eurpolymj.2023.112334

Cited by 14 publications

(4 citation statements)

References 38 publications

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“…Despite the means of introducing pores, the preparation of PIs with low dielectric constants by designing the molecular structure is also an effective means. Common methods include introducing trifluoromethyl groups, 10,15 benzocyclobutene (BCB) structures, 16 bulk structures, 2 ester groups or ether bonds, 9,17 etc. Cheng 16 prepared a series of fluorinated polyimides with different BCB contents.…”

Section: Introductionmentioning

confidence: 99%

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Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Li,

et al. 2024

J. Mater. Chem. C

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Section: Introductionmentioning

confidence: 99%

“…Common methods include introducing trifluoromethyl groups, 10,15 benzocyclobutene (BCB) structures, 16 bulk structures, 2 ester groups or ether bonds, 9,17 etc. Cheng 16 prepared a series of fluorinated polyimides with different BCB contents. The introduced trifluoromethyl and BCB structures contribute to reducing D k and D f .…”

Section: Introductionmentioning

confidence: 99%

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Li,

et al. 2024

J. Mater. Chem. C

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“…Fluorinated PIs have the potential to yield low D k /D f and simultaneously thermoplastic characteristic. [18][19][20] However, they suffer from high cost of fluorinated raw materials and complicated synthetic process. In the highfrequency regime (<10 12 Hz), as the frequency increases, dielectric constant constantly decreases, but the dielectric loss increases to a maximum and then decreases because of dipole orientations.…”

Section: Introductionmentioning

confidence: 99%

“…21 When dipole orientations can fully keep up with the rate of change of the applied electric field or be restricted, there would be minimum dielectric loss. 22,23 Therefore, enhancing the rigidity of polymer chains and intermolecular interaction are able to ensure low D k /D f at high frequency attributed to the restriction of dipole orientations, 19,[24][25][26][27][28] and simultaneously high heat resistance. But the strategy is not conducive to thermoplasticity due to limited movement of polymer chains.…”

Section: Introductionmentioning

confidence: 99%

Thermoplastic polyimide with low dielectric properties enabled by the 2,2′‐spirobifluorene group

Jian,

Lu,

Zhang

et al. 2024

J of Applied Polymer Sci

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Thermoplastic polyimides (TPIs) have melt‐processability and adhesive ability, besides the intrinsic advantages of polyimides. To meet the requirements of applications in high‐frequency communication, TPIs with low dielectric constant (Dk)/dielectric loss factor (Df) at high frequency are also desirable. Enhancing the rigidity of polymer chains and simultaneously intermolecular interaction are effective ways to ensure low Dk/Df, which also benefit to heat resistance. However, it is not conducive to thermoplasticity, due to limited movement of polymer chains. To balance the trade‐off between them, we introduce noncoplanar 2,2′‐spirobifluorene groups to modify the rigidity of polymer chains and regulate the twist between electron‐donor moieties (diamine units) and electron‐acceptor moieties (dianhydride units). It leads to rigid polymer chains, which benefits to good heat resistance and dielectric properties. Meanwhile, the resultant irregular chain structure is difficult to crystallize, which results in thermoplasticity.

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Polyarylene ether nitrile/divinyl siloxane‐bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

He,

Liu,

Tong

2023

J of Applied Polymer Sci

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Polymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high‐performance composite films were prepared by the method of post‐solid phase chemical reaction using polyarylene ether nitrile (PEN) and divinyl siloxane‐bisbenzocyclobutene (BCB) as raw materials. First, parameters of the curing reaction were determined by rheological and activation energy calculations. Then, through adjusting the content of BCB resin and treatment temperature, the performance of PEN/BCB composites could be tuned. Thermal properties have been studied by differential scanning calorimetry, dynamic mechanical analysis, thermal gravimetric analysis, and hot‐disk method. Here, the PEN/BCB composite electric insulating materials with outstanding thermal performance (Tg: 208–400°C, T5%: 469–544°C, thermal conductivity: 1.270–2.215 W/m K). Besides, its mechanical and dielectric properties were investigated in detail. It is noteworthy that the tensile strength of composite film can exceed a maximum of 130 MPa, which is 23.19% higher compared to the untreated one. Also, PEN/BCB composites own low dielectric constant (2.27–4.08 at 1 KHz), and the relationship between frequency or a wide temperature range and dielectric constant/loss is stable. Thus, it has a greater potential for applications in electronics in high‐temperature environments.

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Low dielectric post-cured benzocyclobutene-functionalized fluorine-containing polyimide material

Cited by 14 publications

References 38 publications

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Thermoplastic polyimide with low dielectric properties enabled by the 2,2′‐spirobifluorene group

Polyarylene ether nitrile/divinyl siloxane‐bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

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