Low-dose laser sintering of Cu nanoparticles on the ceramic substrate during ink-jet interconnection

Abstract

The deposition of nano-size copper particles was carried out by means of ink-jet printing on the ceramic substrate (silicon and faience) using Nd +3 :YAG laser. Glycerin and aqueous based nano copper inks were prepared and were inkjetted in this study. The sintered copper film had a grainy structure with neck-like junctions. The microstructure and soldering properties were examined using XRD, SEM-EDX and optical microscopy. The dependence of the electrical resistance of the ink-jetted copper interconnection lines on the parameters of laser sintering regimes was estimated.

Laser-Assisted 3D Printing of Functional Graded Structures from Polymer Covered Nanocomposites: A Self-Review

“…The possibility of the point deposition of thin layer coatings is often used to create conductive layers [9]. Under an intensive study is the possibility of applying the inkjet 3D printing for the graphene electronics fabrication, production of ordered arrays with metallic conductivity and high transparency, for deposition of electrodes of a predetermined shape to a substrate, and also for generation of 2D microarrays in printing electronics.…”

“…In addition to this, the adjustment of 3D printing parameters implies the evaluation of viscosity and surface tension, as well as fine-tuning of the printer for a specific composition. Generally, in order to change the rheology, the additives increasing viscosity, such as glycerin, and surfactants decreasing the surface tension are used [9,12]. Now only a few of inorganic materials among a great variety of those adapted to the 3D inkjet printing and widely used, can be attributed to highly refractive ones, having high transparency and not expensive, they are for example, ZrO 2 , TiO 2 , ZnO, and several mixed oxides.…”

Copper micro-electrode fabrication using laser printing and laser sintering processes for on-chip antennas on flexible integrated circuits

“…Unfortunately, the majority of flexible substrates, which are thermoplastics like PEN or PET, have low glass transition and melting temperatures and consequently they can't be exposed to temperatures in the order of 200-300°C in a furnace. Thus, alternative methods of sintering had to be employed in order to fabricate conductive patterns, such as chemical [17] and photonic sintering [18][19][20][21][22][23][24][25][26][27][28][29][30].…”

“…The utilization of short and ultra-short laser pulses, minimizes the heat affected zone to the order of less than 1 µm, and by employing state of the art galvo-scanning systems, scanning speeds higher than 1 m/s can be readily achieved, offering high throughput and high lateral resolution and at the same time laser pulse intensity can be adjusted according to the requirements of each pattern. The last few years, the laser sintering of copper nanoparticle inks has been extensively studied [24][25][26][27][28][29][30] as well, and the impressive resistivity value of 5.13 µΩ•cm, has been demonstrated by Zenou et al [30], using a CW laser at 532 nm, in 2014. In 2015, Niittynen et al [31] conducted a comparative study between flash light and laser sintering on inkjet printed copper nanoparticle layers, resulting in a resistivity less than 8.55 µΩ•cm for both sintering techniques, with laser sintering providing slightly better results.…”

Calculating the Threshold Energy of the Pulsed Laser Sintering of Silver and Copper Nanoparticles

“…According to this trend, the low-temperature manufacturing process has been an important issue [7][8][9][10]. To solve this, various methods have been suggested.…”