1999
DOI: 10.1109/16.772474
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Low-frequency noise in proton damaged LDD MOSFET's

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Cited by 8 publications
(4 citation statements)
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“…6 for 0.4 mA bias current, where the separate contribution of flicker noise has also been represented. The question of correlation between sources has been analyzed in this case: the simulation of the completely biased detector was done, first considering separately contributions of shot noise, flicker noise, thermal noise, and then adding quadratically all those quantities (15). On the other hand, all the noise sources were included together in a single simulation.…”
Section: B) Pseudo-analytical Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…6 for 0.4 mA bias current, where the separate contribution of flicker noise has also been represented. The question of correlation between sources has been analyzed in this case: the simulation of the completely biased detector was done, first considering separately contributions of shot noise, flicker noise, thermal noise, and then adding quadratically all those quantities (15). On the other hand, all the noise sources were included together in a single simulation.…”
Section: B) Pseudo-analytical Resultsmentioning
confidence: 99%
“…11) inspired in [15] was used to obtain the power spectral density of both the stand-alone diode and a complete detector using model MZB-9161 (as model HSCH-9161 was no longer available at that time). In [16], a more complex scheme is proposed to de-embed the noise contribution of a single detector in a system containing three detectors.…”
Section: Setup For Stand-alone Diode and Detector Power Spectral Dmentioning
confidence: 99%
“…Noise spectroscopy has been applied to the study of deep levels in MOSFETs, 3,[30][31][32][33][34] and a recent application based on lowtemperature noise measurements is illustrated in Fig. 6 for a 0.1 m partially depleted ͑PD͒ SOI technology.…”
Section: Lf Noise Sources and Their Analytical Potentialmentioning
confidence: 99%
“…One technique which appears to be very suitable for this task is Generation-Recombination (GR) noise spectroscopy [1]. Originally, the method has been developed for rather large area semiconductor devices, like, e.g., MOSFETs [1][2][3][4], Charge-Coupled Devices [5] or Junction Field-Effect Transistors [6] to study deep levels in the semiconductor depletion region. It is an alternative to the popular Deep Level Transient Spectroscopy (DLTS) technique [2], the main difference being that the GR centers are studied in dynamic equilibrium, i.e., the noise is due to subsequent capture and emission of free carriers, while in DLTS an emission transient is monitored after trap filling.…”
Section: Introductionmentioning
confidence: 99%