2021 Device Research Conference (DRC) 2021
DOI: 10.1109/drc52342.2021.9467236
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Low Hysteresis MoS2-FET Enabled by CVD-Grown h-BN Encapsulation

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“…Commercially available hexagonal boron nitride (h-BN) layers and different MoS2 layers were transferred from their respective growth substrates onto these prepatterned PI on silicon substrates with a wet transfer technique. The MoS2 was then covered with a second layer of h-BN in order to improve the quality of the interface [41,42] . The channel was patterned by reactive ion etching (RIE) and the electrical contacts to the h-BN/MoS2/h-BN stack were realized by DC sputtering of a 50 nm thick nickel layer.…”
Section: Mos2 Fet Fabrication and Characterizationmentioning
confidence: 99%
“…Commercially available hexagonal boron nitride (h-BN) layers and different MoS2 layers were transferred from their respective growth substrates onto these prepatterned PI on silicon substrates with a wet transfer technique. The MoS2 was then covered with a second layer of h-BN in order to improve the quality of the interface [41,42] . The channel was patterned by reactive ion etching (RIE) and the electrical contacts to the h-BN/MoS2/h-BN stack were realized by DC sputtering of a 50 nm thick nickel layer.…”
Section: Mos2 Fet Fabrication and Characterizationmentioning
confidence: 99%