Low insertion loss substrate integrated waveguide quasi-elliptic filters for V-band wireless personal area network applications

Zelenchuk, Dmitry; Fusco, Vincent

doi:10.1049/iet-map.2010.0362

Cited by 29 publications

(32 citation statements)

References 20 publications

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“…Typical unloaded quality factors (Qfactors) for on-chip resonators at E-band frequencies have been demonstrated only up to 83 [28] for compound transmission line resonators, 43 for shielded transmission line resonators [29], 25 for single transmission line resonators [30] and below 15 for LC tank resonators [31]. This compares poorly with achievable unloaded Q-factors at mm-wave frequencies of over 200 in SIW [32], over 3,000 for ceramic dielectric resonators [30] and Q-factors in excess of 75,000 for machined waveguide resonators [33]. E-band system integration with off-the-shelf components traditionally makes use of pre-packaged components in WR-12 rectangular waveguide [34] [35].…”

Section: Approachesmentioning

confidence: 95%

“…More experimental packaging technologies such as waveguide apertures, micro-coax and through-wafer vias have also been proposed [50] but not yet commercially adopted. With the availability of commercial RF substrates that perform well at E-band and W-band frequencies [32], it should come as no surprise that board-level E-band transceiver developments are performing amicably [49][41][53] [54]. There are, however, still shortcomings in the state-of-the-art, and addressing these shortcomings may lead to improved overall system performances through, amongst others, minimizing interconnect attenuation and reducing the number of on-chip low Q-factor passives.…”

Section: Approachesmentioning

confidence: 99%

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A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Stander

2015

Africon 2015

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Abstract-With an ever increasing number of broadband applications in sub-Saharan Africa, mm-wave point-to-point networking has the potential to fill a niche in communications network architectures. Widespread adoption of this technology would benefit from conventional RF soft substrate integration and packaging, as opposed to system-on-chip or thick film processes. A review on the state-of-the-art in E-band soft substrate systems reveals significant reliance on MMICs. We propose that hybrid integration of active devices with off-chip passives, as well as better integration of active components in SIW, will lead to better performing E-band systems in soft substrates. Specific enabling techniques from the microwave domain are identified.

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Section: Approachesmentioning

confidence: 95%

Section: Approachesmentioning

confidence: 99%

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Stander

2015

Africon 2015

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“…By building frequency-dependent coupling, the SIW filters with inline resonators [1,2,3] are gained considerable attention and many novel structures have been proposed. On the one hand, compared with the cross-coupled filters [4,5], the inline filters can avoid isolation problems between the input and output.…”

Section: Introductionmentioning

confidence: 99%

“…One method is implemented via open and short stubs [1,8]. Although the stub can generate new transmission zeros, its circuit sizes are very large.…”

Section: Introductionmentioning

confidence: 99%

Compact in-line triplet SIW bandpass filter using etched GCPW line resonator

Ding

Tao

2016

IEICE Electron. Express

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This paper presents a novel compact in-line triplet substrate integrated waveguide (SIW) bandpass filter. The filter is composed of two SIW cavity resonators and an etched one-half wavelength grounded coplanar waveguide (GCPW) line resonator. The GCPW line resonator is etched between two SIW cavity resonators to obtain more compact size. A transmission zero on the upper stopband is created by the cross coupling, which allows the filter implementation in in-line with sharp upper cut-off skirts. Finally, a compact third-order 15 dB return loss filter with a fractional bandwidth (FBW) of 7% at 5.5 GHz is designed, fabricated and measured. The experimental results show good agreement between the simulated and measured results. Keywords: etched GCPW line resonator, in-line, triplet, cross coupling, substrate integrated waveguide (SIW) Classification: Microwave and millimeter wave devices, circuits, and systems References

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“…It is therefore tempting to use the simplest in-line topology and increase the selectivity by using similar frequency-dependent couplings as in waveguides. Especially shorted stubs proposed in [17,18] are particularly attractive and simple to implement in SIW. Unfortunately, unless a filter is narrowband, in which case on may use the technique proposed in [7], there is no established way of designing in-line filters with frequency-dependent couplings other than through numerical simulations and full-wave optimization.…”

Section: Introductionmentioning

confidence: 99%

Zero-Pole Approach to Computer Aided Design of in-Line Siw Filters With Transmission Zeros

Jedrzejewski¹,

Leszczynska²,

Szydlowski³

et al. 2012

PIER

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Abstract-This paper presents a design of a new type of in-line pseudo-elliptic filters implemented in substrate integrated waveguide (SIW) technology. To realize transmission zeros in in-line topology, frequency-dependent couplings were used. Such dispersive couplings were implemented as shorted stubs. The design process starts with the generation of a suitable starting point. To this end, an approximation of SIW as a rectangular waveguide is used and a fast electromagnetic solver based on mode-matching technique is utilized (µWave Wizard). The next step is the optimization process of a filter in a full-wave 3D EM simulator Ansoft HFSS. The Optimization routine employs a cost function involving zeros and poles of the rational functions approximating scattering parameters. To increase the speed of convergence, a built-in derivative calculation feature was used and zeros and poles and their derivatives with respect to design parameters were extracted using the vector fitting algorithm. Experimental validation of the method is demonstrated by a third-order filter with asymmetric response and a fifth-order filter with two transmission zeros in addition to an asymmetric response. The experimental results show good agreement between the simulated and measured data.

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Low insertion loss substrate integrated waveguide quasi-elliptic filters for V-band wireless personal area network applications

Cited by 29 publications

References 20 publications

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Compact in-line triplet SIW bandpass filter using etched GCPW line resonator

Zero-Pole Approach to Computer Aided Design of in-Line Siw Filters With Transmission Zeros

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