2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00280
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Low Loss BT resin for substrates in 5G communication module

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Cited by 12 publications
(3 citation statements)
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“…Furthermore, the superior properties of the LTCC technology, such as the potentially high degree of integration, are increasingly losing relevance in modern mm-wave phased array modules not least because of the pervasive use of multi-channel SiGe (Bi)CMOS transceiver chipsets [87], [98]. As a result, the latest module trends for electronically steerable antennas up to the Ka-band are almost exclusively realized with PPE-or PTFE-based dielectric materials albeit the use of low-loss insulator materials such as bis-maleimide & Triazine resins [99] are increasingly gaining momentum in advanced packaging for 5G applications [100]. Fig.…”
Section: A Integration Optionsmentioning
confidence: 99%
“…Furthermore, the superior properties of the LTCC technology, such as the potentially high degree of integration, are increasingly losing relevance in modern mm-wave phased array modules not least because of the pervasive use of multi-channel SiGe (Bi)CMOS transceiver chipsets [87], [98]. As a result, the latest module trends for electronically steerable antennas up to the Ka-band are almost exclusively realized with PPE-or PTFE-based dielectric materials albeit the use of low-loss insulator materials such as bis-maleimide & Triazine resins [99] are increasingly gaining momentum in advanced packaging for 5G applications [100]. Fig.…”
Section: A Integration Optionsmentioning
confidence: 99%
“…The semiconducting materials have identified five major growth applications: (1) mobile, such as smartphones, notebooks, wearables, tablets, etc., [1][2][3][4]; (2) high-performance computing (HPC), which is able to process data and perform complex calculations at high speeds on a supercomputer [5,6]; (3) self-driving cars [7]; (4) Internet Of Things (IOT), such as smart health and smart factories; [3,8,9] and (5) instant data (for edge computing) and big data (for cloud computing) [5,6]. To meet the requirements for boosting signal transmission speed/rate and managing a huge data flood, low-loss (dissipation factor or loss tangent) and permittivity materials are highly preferred [10,11].…”
Section: Introductionmentioning
confidence: 99%
“…The semiconductor industry has identified five major growth engines (applications): (1) mobile, such as smartphones, smartwatches, notebooks, wearables, tablets, etc., [ 1 , 2 , 3 , 4 ]; (2) high-performance computing (HPC), also known as supercomputing, which is able to process data and perform complex calculations at high speeds on a supercomputer [ 5 , 6 ]; (3) autonomous vehicle (or self-driving cars) [ 7 ]; (4) IoT (internet of things), such as smart factories and smart health; [ 3 , 8 , 9 ] and (5) big data (for cloud computing) and instant data (for edge computing) [ 5 , 6 ]. The system-technology drivers such as 5G (fifth generation technology standard for broadband cellular networks) are boosting the growth of these five semiconductor applications.…”
Section: Introductionmentioning
confidence: 99%