Abstract:Photonic integrated circuits (PICs) have experienced an exponential growth in a number of applications, including telecom/datacom, LiDAR, optical sensing/metrology and quantum technology. Most materials and platforms commonly used in integrated photonics, such as silicon-on-insulator (SOI), silicon nitride (Si3N4) and indium phosphide (InP) do not show transmission below ~400 nm, hindering the development of PICs operating in the ultraviolet wavelength range. Furthermore, devices in this wavelength range also … Show more
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