Low power consumption physics package for chip-scale atomic clock through gold-tin eutectic bonding

Guo, Ping; Meng, Hongling; Dan, Lin; Zhao, Jianye

doi:10.1007/s00542-022-05283-y

Microsyst Technol

2022

DOI: 10.1007/s00542-022-05283-y

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Low power consumption physics package for chip-scale atomic clock through gold-tin eutectic bonding

Ping Guo

Hongling Meng²,

Lin Dan

et al.

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Low power consumption physics package for chip-scale atomic clock through gold-tin eutectic bonding

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References 33 publications

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