2000 Digest of the LEOS Summer Topical Meetings. Electronic-Enhanced Optics. Optical Sensing in Semiconductor Manufacturing. El
DOI: 10.1109/leosst.2000.869694
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Low-power short-distance optical interconnect using imaging fibre bundles and CMOS detectors

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“…This folding of optical pathways can be implemented by arranging flexible small diameter plastic optical fibers (POF) in a 2D-array configuration [9][10][11]. Also a flexible fiber-imaging guide (FIG) can provide a solution here [12][13][14]. Both guidedwave based OPBs have the advantage of being well suited to bridge interconnection distances from a couple of centimeters up to a few tens of centimeters, since the light does not suffer from beam diverging effects as it remains confined to the wave-guide.…”
Section: Introductionmentioning
confidence: 99%
“…This folding of optical pathways can be implemented by arranging flexible small diameter plastic optical fibers (POF) in a 2D-array configuration [9][10][11]. Also a flexible fiber-imaging guide (FIG) can provide a solution here [12][13][14]. Both guidedwave based OPBs have the advantage of being well suited to bridge interconnection distances from a couple of centimeters up to a few tens of centimeters, since the light does not suffer from beam diverging effects as it remains confined to the wave-guide.…”
Section: Introductionmentioning
confidence: 99%