“…To minimise leakage current and improve gate control, it is desirable that the equivalent oxide thickness (EOT) [12] be as low as possible. For EOT to be a minimum, gate stacking is used where a high‐K dielectric material HfO 2 [13] is used to complement SiO 2 as a gate stacking material. Improved gate control is achieved by increasing gate oxide capacitance ( C ox ) [14].…”