Low-pressure, thermo-compressive lamination

Jurków, Dominik; Gołonka, Leszek

doi:10.1016/j.jeurceramsoc.2011.12.033

Cited by 16 publications

(23 citation statements)

References 16 publications

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“…Thermo-compressive lamination can cause structure deformation because of joining tapes at elevated temperature under high pressure. It has been proven that a reduction of lamination pressure is possible [85] and thermo-compressive bonding can be carried out under 0.5 MPa. Such low pressure permits the fabrication of structures with very thin LTCC membranes down to 40 µm thickness [85].…”

Section: Thermo-compressive Methodsmentioning

confidence: 99%

“…It has been proven that a reduction of lamination pressure is possible [85] and thermo-compressive bonding can be carried out under 0.5 MPa. Such low pressure permits the fabrication of structures with very thin LTCC membranes down to 40 µm thickness [85]. We can conclude that thermo-compression is very useful for the lamination of tapes with thick-film components and that it permits bonding of up to 40 layers.…”

Section: Thermo-compressive Methodsmentioning

confidence: 99%

“…This elongation can be avoided if a final structure has only open cavities. In this latter case, such 3D mechanical structures can be protected by rubber-like insert material [85,89], which sustains the structure during lamination and is taken out after it.…”

Section: Thermo-compressive Lamination With Sacrificial Materialsmentioning

confidence: 99%

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Overview on low temperature co-fired ceramic sensors

Jurków

Maeder

Dąbrowski

et al. 2015

Sensors and Actuators A: Physical

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Low Temperature Co-fired Ceramics (LTCC) is one of the microelectronic techniques. This technology was initially developed as an alternative to Printed Circuit Boards (PCB) and classical thick-film technology, and it has found application in the fabrication of multilayer ceramic boards for electronic devices. Fast and wide development of this technology permitted the fabrication of 3D mechanical structures and integration with various different processes. Thanks to this, LTCC has found application in the manufacturing of various microelectronic devices. This paper presents an overview on LTCC technology and gives a detailed summary on physical quantity sensors fabricated using LTCC technique.

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Section: Thermo-compressive Methodsmentioning

confidence: 99%

Section: Thermo-compressive Methodsmentioning

confidence: 99%

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Overview on low temperature co-fired ceramic sensors

Jurków

Maeder

Dąbrowski

et al. 2015

Sensors and Actuators A: Physical

Self Cite

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“…The LTCC firing process is also critical to the quality of these embedded cavities, as the capillary force of the melted glass phase in the laminates and their physical shrinkage in the planar direction can deform or even destroy the embedded fluidic structure. 23,42 Both the DP951 and HL2k samples, laminated under varying T and P, were sintered under their standard firing profiles (see Table 2). Interestingly, the results showed very different deformation profiles for the two kinds of LTCC materials (see Fig.…”

Section: Laser Micromachining Of Ltcc Green Tapesmentioning

confidence: 99%

“…One method is using temporary inserts to introduce mechanical supports to the LTCC cavities to avoid deformation and/or sagging during lamination. These inserts, usually solid flexible objects, 23 are removed right after lamination. However, the removal of inserts from the laminate can cause permanent damage to these fluidic structures.…”

Section: Introductionmentioning

confidence: 99%

Fine structuration of low-temperature co-fired ceramic (LTCC) microreactors

et al. 2015

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The development of microreactors that operate under harsh conditions is always of great interest for many applications. Here we present a microfabrication process based on low-temperature co-fired ceramic (LTCC) technology for producing microreactors which are able to perform chemical processes at elevated temperature (>400°C) and against concentrated harsh chemicals such as sodium hydroxide, sulfuric acid and hydrochloric acid. Various micro-scale cavities and/or fluidic channels were successfully fabricated in these microreactors using a set of combined and optimized LTCC manufacturing processes. Among them, it has been found that laser micromachining and multi-step low-pressure lamination are particularly critical to the fabrication and quality of these microreactors. Demonstration of LTCC microreactors with various embedded fluidic structures is illustrated with a number of examples, including micro-mixers for studies of exothermic reactions, multiple-injection microreactors for ionone production, and high-temperature microreactors for portable hydrogen generation. IntroductionChemical microreactors are a type of meso-scaled reaction systems that have fluidic channels with characteristic dimensions in the sub-millimeter range. By combining process intensification concepts with microfabrication techniques, these microreactors have been rapidly developed to perform liquid/gas phase chemical reactions, particularly the quasiinstantaneous endothermic or exothermic ones.1,2 Ceramic materials in general feature high chemical and thermal stability. Hence they are very preferable to be used as reactor construction materials, especially for reactors involved with high temperature and/or harsh chemical reactions. be used as the embedded fluidic structures (e.g. channels or cavities) get easily damaged in the stacked LTCC tapes by the high lamination temperature and/or pressure, causing sagging, tearing and cracking issues. Several approaches have been proposed so far in order to reduce these deformations and improve the quality of integrated LTCC fluidic structures. One method is using temporary inserts to introduce mechanical supports to the LTCC cavities to avoid deformation and/or sagging during lamination. These inserts, usually solid flexible objects, 23 are removed right after lamination. However, the removal of inserts from the laminate can cause permanent damage to these fluidic structures. Besides, this method is not applicable for fabricating fully embedded fluidic channels. Alternatively, a chemical-assisted lamination process has been proposed that enables low-pressure and/or lowtemperature bonding of LTCC green tapes. Roosen et al. 24used double-sided adhesive tape that contains acrylate adhesives and a polyethylene terephthalate (PET) film to ensure temporary binding of green tapes under a low lamination pressure at ambient temperature. Upon heating (40-60°C), these adhesives, together with the binders in the LTCC green tapes, soften and join the laminates through capillary forces. Aside from adhesives, ...

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