2007
DOI: 10.1088/0022-3727/40/2/031
|View full text |Cite
|
Sign up to set email alerts
|

Low-resistance titanium/n-type silicon (1 0 0) contacts by monolayer selenium passivation

Abstract: Low-resistance Ohmic contacts fabricated by selenium passivation between titanium and n-type silicon (1 0 0) substrates have been characterized by the four-point probe and circular transmission line method. Selenium passivation terminates dangling bonds on the Si(1 0 0) surface and reduces the Schottky barrier height between Ti and n-type Si(1 0 0) substrates. Sheet resistance of the Ti–Si contacts on Se-passivated 1019 cm−3 doped Si substrates shows a ∼30% reduction as compared with control samples. According… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

1
6
0

Year Published

2007
2007
2022
2022

Publication Types

Select...
10

Relationship

0
10

Authors

Journals

citations
Cited by 13 publications
(7 citation statements)
references
References 16 publications
1
6
0
Order By: Relevance
“…Lowering of Schottky barrier height by valence mending is not limited to Al as the metal or S as the passivating agent. A similar lowering effect has been observed between Ti and n-type Si(100) surface by MBE Se passivation (18). In that case, a reduction of ~0.2 eV in barrier height, from no more than 0.3 eV for Ti contacts on n-type Si(100) surface without Se passivation to no more than 0.1 eV with Se passivation, is achieved.…”
Section: Low Schottky Barriers For Electronssupporting
confidence: 75%
“…Lowering of Schottky barrier height by valence mending is not limited to Al as the metal or S as the passivating agent. A similar lowering effect has been observed between Ti and n-type Si(100) surface by MBE Se passivation (18). In that case, a reduction of ~0.2 eV in barrier height, from no more than 0.3 eV for Ti contacts on n-type Si(100) surface without Se passivation to no more than 0.1 eV with Se passivation, is achieved.…”
Section: Low Schottky Barriers For Electronssupporting
confidence: 75%
“…To make it ohmic, high-doped n-region is preferred which makes the processing complex. Many literatures have suggested for Ti/Au contact in which Ti is for adhesive as well as barrier lowering with Si and Au for low resistivity of contact 79 . We performed experiment with Ti/Au layering on n-Si using sputtering method.…”
Section: Resultsmentioning
confidence: 99%
“…If the resistance of the vacuum gap changed significantly, that would cause a significant increase in the current at high voltage in the I-V curves, which is not observed. However, for substrates with doping concentrations of ~10 17 cm -3 , the junction resistance at the TiSi 2 /Si interface is ~50 to 100 kΩ [55], which is similar in magnitude to the quantum of resistance. The Schottky barrier height of nanoscale islands has been shown to be lowered significantly [27,30] relative to the bulk barrier height.…”
Section: (B) To 5(d)mentioning
confidence: 88%