1992
DOI: 10.1063/1.350535
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Low-resistivity epitaxial YBa2Cu3O7 thin films with improved microstructure and reduced microwave losses

Abstract: Epitaxial thin films of YBa2C!u307 have been prepared on SrTiOs and LaAlOs substrates by a high-pressure planar dc-sputtering technique. By covering the substrate heater with a frame of polycrystalline YBazCu30~ -substantial improvements of the YBa2Cu307 film properties were achieved. These are characterized by dc-resistivity values p(T) of less than 50 @I cm at 100 K and ~(300 K)/p( 100 K) values of up to 3.9. Significant deviations from the usual linear p(T) behavior were found. Critical temperatures above 9… Show more

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Cited by 130 publications
(49 citation statements)
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“…The typical superconducting transition temperature T c of YBCO films obtained by PLD is ≈ 89 K, which is significantly lower than T c ≈ 93 K obtained for bulk ceramic samples of YBCO. The technique of sputtering at high oxygen pressures allows a smart and homogeneous onaxis in-situ deposition of high-quality metal-oxide thin films from stoichiometric targets (Poppe et al, 1990(Poppe et al, , 1992. Conventional sputtering is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing.…”
Section: Deposition Of Epitaxial Metal-oxide Heterostructuresmentioning
confidence: 99%
“…The typical superconducting transition temperature T c of YBCO films obtained by PLD is ≈ 89 K, which is significantly lower than T c ≈ 93 K obtained for bulk ceramic samples of YBCO. The technique of sputtering at high oxygen pressures allows a smart and homogeneous onaxis in-situ deposition of high-quality metal-oxide thin films from stoichiometric targets (Poppe et al, 1990(Poppe et al, , 1992. Conventional sputtering is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing.…”
Section: Deposition Of Epitaxial Metal-oxide Heterostructuresmentioning
confidence: 99%
“…YBCO films having 500 Å thickness and c-axis orientation were epitaxially grown in a high pressure ͑3.4 mbar͒ pure oxygen dc sputtering system. 22 In the deposition process the substrate temperature is 900°C. Electrodes had transition temperatures (T C ) in the range 89.5-91 K, transition widths smaller than 0.2 K and critical currents densities higher than 10 6 A/cm 2 at 77 K. Films were patterned by wet etching in H 3 PO 4 , obtaining junctions widths ranging between 2 and 50 m. Patterned microbridges ͑barriers and electrodes͒ were irradiated at room temperature with 80 keV He ϩ ions incident 7°from the surface normal to avoid channelling effect.…”
Section: Methodsmentioning
confidence: 99%
“…A subsequent encapsulation then ensures the long-term stability of the sensor. The average size of the growth spirals of the YBa 2 Cu 3 O 7Ϫx films, deposited by the high-oxygen-pressure dc-sputtering technique, 6 is about 1 m compared to the about 0.3 m grains of conventional laser-ablated films. 9 This makes it possible for the sputtered films to produce junctions between the individual growth spirals, thus contributing to the homogeneity and increasing the tunneling part of the critical current density of the junction.…”
mentioning
confidence: 95%
“…It was observed 4,5 that the I c R n product of bicrystal junctions increases with critical current density J c as I c R n ϰ(J c ) 0. 6 . In order to keep I c fixed at an optimal level for SQUID operation, to provide narrow junction conditions, and simultaneously to increase J c and R n it is necessary to reduce the junction width to a submicrometer scale.…”
mentioning
confidence: 99%
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