2007
DOI: 10.1016/j.sse.2007.02.028
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Low resistivity ohmic contact to n-type poly-GaN using a Ti/Au/Ni/Au multilayer metal system

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Cited by 3 publications
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“…This is done with the help of a plasma sputtered ZrO x mask. During annealing NiO is built at the metal/semiconductor interface and allows a low specific resistance of the junction [5].…”
Section: Growth and Processingmentioning
confidence: 99%
“…This is done with the help of a plasma sputtered ZrO x mask. During annealing NiO is built at the metal/semiconductor interface and allows a low specific resistance of the junction [5].…”
Section: Growth and Processingmentioning
confidence: 99%