2007
DOI: 10.1889/1.2759549
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Low‐temperature amorphous‐silicon backplane technology development for flexible displays in a manufacturing pilot‐line environment

Abstract: Abstract— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical st… Show more

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Cited by 44 publications
(16 citation statements)
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“…The temporary rigid carrier allows the flexible display to be processing using unmodified, off-the-shelf, thin-film semiconductor process tooling, designed for rigid glass substrates or silicon wafers. Additional details on the TFT display process sequence used to manufacture our OLED displays on flexible plastic substrates is provided by O'Brien, et al [14] and Raupp, et al [20].…”
Section: B Flexible Oled Display Technologymentioning
confidence: 99%
“…The temporary rigid carrier allows the flexible display to be processing using unmodified, off-the-shelf, thin-film semiconductor process tooling, designed for rigid glass substrates or silicon wafers. Additional details on the TFT display process sequence used to manufacture our OLED displays on flexible plastic substrates is provided by O'Brien, et al [14] and Raupp, et al [20].…”
Section: B Flexible Oled Display Technologymentioning
confidence: 99%
“…Snaplet consists of an Arizona State University Flexible Display Center 3.7" Bloodhound flexible electrophoretic display [7], augmented with a layer of 5 Flexpoint 2" bidirectional bend sensors and 6 pressure sensors. The prototype is driven by an E Ink [1] Broadsheet AM300 Kit featuring a Gumstix processor.…”
Section: Apparatusmentioning
confidence: 99%
“…This interface is potentially even more important for an emerging application of a-Si:H in flexible electronics. The opportunities afforded for electronics fabricated on flexible, robust substrates such as plastic are in some cases stifled by the limitations imposed by the substrate [20]. One major limitation as related to a-Si:H is the processing temperature afforded by the relatively low thermal stability of most plastics; this has limited the maximum temperature in our previous work utilizing a-Si:H based transistor arrays on plastic substrates for display backplanes to less than 180°C [20].…”
Section: Introductionmentioning
confidence: 99%
“…The opportunities afforded for electronics fabricated on flexible, robust substrates such as plastic are in some cases stifled by the limitations imposed by the substrate [20]. One major limitation as related to a-Si:H is the processing temperature afforded by the relatively low thermal stability of most plastics; this has limited the maximum temperature in our previous work utilizing a-Si:H based transistor arrays on plastic substrates for display backplanes to less than 180°C [20]. However, this decreased temperature leads to an increased susceptibility of the a-Si:H to the threshold voltage shift during operation [21,22].…”
Section: Introductionmentioning
confidence: 99%